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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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STM32L431 датащи(PDF) 173 Page - STMicroelectronics |
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STM32L431 датащи(HTML) 173 Page - STMicroelectronics |
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173 / 200 page  DocID028800 Rev 1 173/200 STM32L431xx Package information 197 Figure 46. UFBGA100 - 100-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array package recommended footprint Device marking The following figure gives an example of topside marking orientation versus ball A1 identifier location. F 0.700 0.750 0.800 0.0276 0.0295 0.0315 ddd - - 0.100 - - 0.0039 eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 91. UFBGA100 recommended PCB design rules (0.5 mm pitch BGA) Dimension Recommended values Pitch 0.5 Dpad 0.280 mm Dsm 0.370 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.280 mm Stencil thickness Between 0.100 mm and 0.125 mm Table 90. UFBGA100 - 100-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array package mechanical data (continued) Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. |
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