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STM32L162VE датащи(PDF) 104 Page - STMicroelectronics |
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STM32L162VE датащи(HTML) 104 Page - STMicroelectronics |
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104 / 129 page ![]() Electrical characteristics STM32L162xE 104/129 DocID025882 Rev 6 Figure 28. Maximum dynamic current consumption on VREF+ supply pin during ADC conversion General PCB design guidelines Power supply decoupling should be performed as shown in Figure 10. The applicable procedure depends on whether VREF+ is connected to VDDA or not. The 100 nF capacitors should be ceramic (good quality). They should be placed as close as possible to the chip. ADC clock Sampling (n cycles) Conversion (12 cycles) Iref+ 300µA 700µA MS36686V1 Table 57. Maximum source impedance RAIN max(1) Ts (µs) RAIN max (kΩ) Ts (cycles) fADC=16 MHz(2) Multiplexed channels Direct channels 2.4 V < VDDA < 3.6 V 1.8 V < VDDA < 2.4 V 2.4 V < VDDA < 3.6 V 1.8 V < VDDA < 2.4 V 0.25 Not allowed Not allowed 0.7 Not allowed 4 0.5625 0.8 Not allowed 2.0 1.0 9 1 2.0 0.8 4.0 3.0 16 1.5 3.0 1.8 6.0 4.5 24 3 6.8 4.0 15.0 10.0 48 6 15.0 10.0 30.0 20.0 96 12 32.0 25.0 50.0 40.0 192 24 50.0 50.0 50.0 50.0 384 1. Guaranteed by design. 2. Number of samples calculated for fADC = 16 MHz. For fADC = 8 and 4 MHz the number of sampling cycles can be reduced with respect to the minimum sampling time Ts (µs), |
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