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STM32L100C6 датащи(PDF) 85 Page - STMicroelectronics

номер детали STM32L100C6
подробное описание детали  Ultra-low-power platform
PDF  103 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
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STM32L100C6 датащи(HTML) 85 Page - STMicroelectronics

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STM32L100C6 STM32L100R8/RB
Electrical characteristics
90
Figure 24. Maximum dynamic current consumption on VDDA supply pin during ADC
conversion
General PCB design guidelines
Power supply decoupling should be performed as shown in Figure 8, depending on whether
VREF+ is connected to VDDA or not. The 100 nF capacitors should be ceramic (good quality).
They should be placed as close as possible to the chip.
ADC clock
Sampling (n cycles)
Conversion (12 cycles)
IDDA
1300 µA
1700 µA
MS36686V1
Table 55. Maximum source impedance RAIN max(1)
Ts
(µs)
RAIN max (kOhm)
Ts (cycles)
fADC= 16 MHz(2)
Multiplexed channels
Direct channels
2.4 V < VDDA< 3.6 V 1.8 V < VDDA < 2.4 V 2.4 V < VDDA< 3.3 V 1.8 V < VDDA < 2.4 V
0.25
Not allowed
Not allowed
0.7
Not allowed
4
0.5625
0.8
Not allowed
2.0
1.0
9
1
2.0
0.8
4.0
3.0
16
1.5
3.0
1.8
6.0
4.5
24
3
6.8
4.0
15.0
10.0
48
6
15.0
10.0
30.0
20.0
96
12
32.0
25.0
50.0
40.0
192
24
50.0
50.0
50.0
50.0
384
1. Guaranteed by design.
2. Number of samples calculated for fADC = 16 MHz. For fADC = 8 and 4 MHz the number of sampling cycles can be
reduced with respect to the minimum sampling time Ts (us).



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