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STM32F078CB датащи(PDF) 51 Page - STMicroelectronics

номер детали STM32F078CB
подробное описание детали  CRC calculation unit
PDF  120 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
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STM32F078CB датащи(HTML) 51 Page - STMicroelectronics

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STM32F078CB, STM32F078RB, STM32F078VB
Electrical characteristics
95
6.3
Operating conditions
6.3.1
General operating conditions
6.3.2
Operating conditions at power-up / power-down
The parameters given in Table 24 are derived from tests performed under the ambient
temperature condition summarized in Table 23.
Table 23. General operating conditions
Symbol
Parameter
Conditions
Min
Max
Unit
fHCLK
Internal AHB clock frequency
-
0
48
MHz
fPCLK
Internal APB clock frequency
-
0
48
VDD
Standard operating voltage
-
1.65
1.95
V
VDDIO2
I/O supply voltage
Must not be supplied if VDD
is not present
1.65
3.6
V
VDDA
Analog operating voltage
(ADC and DAC not used)
Must have a potential equal
to or higher than VDD
VDD
3.6
V
Analog operating voltage
(ADC and DAC used)
2.4
3.6
VBAT
Backup operating voltage
-
1.65
3.6
V
VIN
I/O input voltage
TC and RST I/O
–0.3
VDDIOx+0.3
V
TTa and POR I/O
–0.3
VDDA+0.3(1)
FT and FTf I/O
–0.3
5.2(1)
BOOT0
0
5.2
PD
Power dissipation at TA = 85 °C
for suffix 6 or TA = 105 °C for
suffix 7(2)
UFBGA100
-
364
mW
LQFP100
-
476
LQFP64
-
455
LQFP48
-
370
UFQFPN48
-
625
WLCSP49
-
408
TA
Ambient temperature for the
suffix 6 version
Maximum power dissipation
–40
85
°C
Low power dissipation(3)
–40
105
Ambient temperature for the
suffix 7 version
Maximum power dissipation
–40
105
°C
Low power dissipation(3)
–40
125
TJ
Junction temperature range
Suffix 6 version
–40
105
°C
Suffix 7 version
–40
125
1. For operation with a voltage higher than VDDIOx + 0.3 V, the internal pull-up resistor must be disabled.
2. If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax. See Section 7.7: Thermal characteristics.
3. In low power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax (see Section 7.7:
Thermal characteristics
).



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