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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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STM8L151C4 датащи(PDF) 112 Page - STMicroelectronics |
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STM8L151C4 датащи(HTML) 112 Page - STMicroelectronics |
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112 / 142 page  Electrical parameters STM8L151x4/6, STM8L152x4/6 112/142 DocID15962 Rev 15 Figure 40. Maximum dynamic current consumption on VREF+ supply pin during ADC conversion General PCB design guidelines Power supply decoupling should be performed as shown in Figure 41 or Figure 42, depending on whether VREF+ is connected to VDDA or not. Good quality ceramic 10 nF capacitors should be used. They should be placed as close as possible to the chip. ADC clock Sampling (n cycles) Conversion (12 cycles) Iref+ 300µA 700µA Table 57. RAIN max for fADC = 16 MHz(1) Ts (cycles) Ts (µs) RAIN max (kohm) Slow channels Fast channels 2.4 V < VDDA < 3.6 V 1.8 V < VDDA < 2.4 V 2.4 V < VDDA < 3.3 V 1.8 V < VDDA < 2.4 V 4 0.25 Not allowed Not allowed 0.7 Not allowed 9 0.5625 0.8 Not allowed 2.0 1.0 16 1 2.0 0.8 4.0 3.0 24 1.5 3.0 1.8 6.0 4.5 48 3 6.8 4.0 15.0 10.0 96 6 15.0 10.0 30.0 20.0 192 12 32.0 25.0 50.0 40.0 384 24 50.0 50.0 50.0 50.0 1. Guaranteed by design. |
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