FT311D-32L1C-R datasheet(30/40 Pages) FTDI

номер детали	FT311D-32L1C-R

подробное описание детали	USB Android Host IC

PDF	40 Pages

Scroll/Zoom	100%

производитель	FTDI [Future Technology Devices International Ltd.]

домашняя страница	http://www.ftdichip.com

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DS_FT311D

USB ANDROID HOST IC Datasheet

Version 1.2

Document No.: FT_000660 Clearance No.: FTDI# 305

9 Package Parameters

FT311D is available in RoHS Compliant packages, QFN package (32QFN) and an LQFP package (32LQFP).

The packages are lead (Pb) free and use a ‘green’ compound. The package is fully compliant with

European Union directive 2002/95/EC.

The mechanical drawings of the packages are shown in sections 9.2- all dimensions are in millimetres.

The solder reflow profile for all packages can be viewed in Section 9.3.

9.1 FT311D Package Markings

9.1.1 QFN-32

An example of the markings on the QFN package are shown in Figure 9-1. The FTDI part number is too

long for the 32 QFN package so in this case the last two digits are wrapped down onto the date code line.

Figure 9-1 QFN Package Markings

1C should be printed on line 4, then a space and then the Date Code.

1. YYWW = Date Code, where YY is year and WW is week number

2. Marking alignment should be centre justified

3. Laser Marking should be used

4. All marking dimensions should be marked proportionally. Marking font should be using

Unisem standard font (Roman Simplex)

FTDI

XXXXXXXX

FT311D-32Q

Line 1 – FTDI Logo

Line 4 – Revision and Date

Code

Line 2 – Wafer Lot Number

Line 3 – FTDI Part Number

1C YYWW

FT311D-32L1C-R датащи(PDF) 30 Page - Future Technology Devices International Ltd.