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MCP6V92 датащи(PDF) 19 Page - Microchip Technology

номер детали MCP6V92
подробное описание детали  Temperature Measurement
PDF  48 Pages
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производитель  MICROCHIP [Microchip Technology]
домашняя страница  http://www.microchip.com
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MCP6V92 датащи(HTML) 19 Page - Microchip Technology

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 2015-2016 Microchip Technology Inc.
DS20005434B-page 19
MCP6V91/1U/2/4
4.1.3
INTERMODULATION DISTORTION
(IMD)
These op amps will show intermodulation distortion
(IMD) products when an AC signal is present.
The signal and clock can be decomposed into sine
wave tones (Fourier series components). These tones
interact with the zero-drift circuitry’s nonlinear response
to produce IMD tones at sum and difference
frequencies. Each of the square wave clock’s
harmonics has a series of IMD tones centered on it
(see Figures 2-40 and 2-41).
4.2
Other Functional Blocks
4.2.1
RAIL-TO-RAIL INPUTS
The input stage of the MCP6V91/1U/2/4 op amps uses
two differential CMOS input stages in parallel. One
operates at low common-mode input voltage (VCM,
which is approximately equal to VIN+ and VIN- in normal
operation), and the other operates at high VCM. With
this topology, the input operates with VCM up to
VDD + 0.3V and down to VSS – 0.2V, at +25°C (see
Figure 2-19). The input offset voltage (VOS) is
measured at VCM =VSS – 0.2V and VDD +0.3V to
ensure proper operation.
4.2.1.1
Phase Reversal
The input devices are designed to not exhibit phase
inversion when the input pins exceed the supply
voltages.
Figure 2-46 shows
an
input voltage
exceeding both supplies with no phase inversion.
4.2.1.2
Input Voltage Limits
In order to prevent damage and/or improper operation
of these amplifiers, the circuit must limit the voltages at
the input pins (see Section 1.1 “Absolute Maximum
Ratings †”). This requirement is independent of the
input current limits discussed later on.
The ESD protection on the inputs can be depicted as
shown in Figure 4-4. This structure was chosen to
protect the input transistors against many (but not all)
overvoltage conditions and to minimize input bias
current (IB).
FIGURE 4-4:
Simplified Analog Input ESD
Structures.
The input ESD diodes clamp the inputs when they try to
go more than one diode drop below VSS. They also
clamp any voltages well above VDD; their breakdown
voltage is high enough to allow normal operation but not
low enough to protect against slow overvoltage (beyond
VDD) events. Very fast ESD events (that meet the
specification) are limited so that damage does not occur.
In some applications, it may be necessary to prevent
excessive voltages from reaching the op amp inputs;
Figure 4-5 shows one approach to protecting these
inputs. D1 and D2 may be small signal silicon diodes,
Schottky diodes for lower clamping voltages or
diode-connected FETs for low leakage.
FIGURE 4-5:
Protecting the Analog Inputs
Against High Voltages.
Bond
Pad
Bond
Pad
Bond
Pad
VDD
VIN+
VSS
Input
Stage
Bond
Pad
VIN
V1
VDD
D1
VOUT
V2
D2
U1
MCP6V9X
+
-



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