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LAN88730 датащи(PDF) 75 Page - Microchip Technology

номер детали LAN88730
подробное описание детали  Small Footprint MII/RMII 10/100 Ethernet Transceiver for Automotive Applications
PDF  82 Pages
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производитель  MICROCHIP [Microchip Technology]
домашняя страница  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

LAN88730 датащи(HTML) 75 Page - Microchip Technology

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 2012-2015 Microchip Technology Inc.
DS60001256B-page 75
LAN88730
RECOMMENDED LAND PATTERN
Dimension Limits
Units
C2
Optional Center Pad Width
Contact Pad Spacing
Optional Center Pad Length
Contact Pitch
Y2
X2
3.40
3.40
MILLIMETERS
0.50 BSC
MIN
E
MAX
4.90
Contact Pad Length (X32)
Contact Pad Width (X32)
Y1
X1
0.85
0.30
NOM
SILK SCREEN
1
2
32
C1
Contact Pad Spacing
4.90
Space Between Contacts (X28)
G1
0.20
Thermal Via Diameter
V
Thermal Via Pitch
EV
0.33
1.20
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
E
C1
C2
EV
EV
X1
Y1
X2
Y2
G1
ØV
Microchip Technology Drawing C04-2232A
32-Lead Very Thin Plastic Quad Flat, No Lead Package (RN) - 5x5 mm Body [VQFN]
With 3.3x3.3 mm Exposed Pad, Punch Singulated; Formerly called QFN



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