SST11CP22

DS70005126B-page 12

 2015 Microchip Technology Inc.

Microchip Technology Drawing C04-252A Sheet 2 of 2

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

20-Lead Ultra Thin Quad Flat Pack, No Lead (GN) - 4x4x0.55 mm Body (UQFN)

Number of Pins

Overall Height

Terminal Width

Overall Width

Overall Length

Terminal Length

Exposed Pad Width

Exposed Pad Length

Terminal Thickness

Pitch

Standoff

Units

Dimension Limits

A1

A

b

D

E2

D2

(A3)

e

L

E

N

0.50 BSC

0.15 REF

2.45

2.45

0.35

0.20

0.50

0.00

0.25

4.00 BSC

0.40

2.50

2.50

0.55

0.02

4.00 BSC

MILLIMETERS

MIN

NOM

20

2.55

2.55

0.45

0.30

0.60

0.05

MAX

K-

0.20

-

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

1.

2.

3.

Notes:

Pin 1 visual index feature may vary, but must be located within the hatched area.

Package is saw singulated

Dimensioning and tolerancing per ASME Y14.5M

Terminal-to-Exposed-Pad