 2015 Microchip Technology Inc.

DS70005126B-page 11

SST11CP22

5.0

PACKAGE INFORMATION

B

A

0.20 C

0.20 C

D

D2

E2

E

20 X b

0.07

C A B

0.05

C

(DATUM B)

(DATUM A)

C

SEATING

PLANE

NOTE 1

1

2

N

2X

TOP VIEW

SIDE VIEW

BOTTOM VIEW

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

e

NOTE 1

1

2

N

0.10

C A B

0.10

C A B

(A3)

0.10 C

0.08 C

A1

Microchip Technology Drawing C04-252A Sheet 1 of 2

20-Lead Ultra Thin Quad Flat Pack, No Lead (GN) - 4x4x0.55 mm Body (UQFN)

2X

K

L

A