Symbol

A

A1

A2

b

D

E

E1

e

h

L

L1

L2

Dimension

(mm)

MIN

1.35*

0.10

1.25

0.31

9.80*

5.80*

3.80*

1.27

BSC

0.25

0.40

1.04

REF

0.25

BSC

NOM

-

-

-

-

9.90

6.00

3.90

-

-

-

-

MAX

1.75

0.25

1.65*

0.51

10.00* 6.20*

4.00*

0.50

1.27

JEDEC Registration MS-012, Variation AC, Issue E, Sept. 2005.

Drawings are not to scale.

Top View

Side View

View A-A

View B

A

A

Seating

Plane

16

1

Seating

Plane

Gauge

Plane

L

L1

L2

θ1

θ

View B

h

h

b

A

A2

A1

e

E

E1

D

Note 1

(Index Area

D/2 x E1/2)

Note:

1.

16-Lead SOIC (Narrow Body) Package Outline (NG)

Pins #2 and #3 Trimmed

9.90x3.90mm body, 1.75mm height (max), 1.27mm pitch

Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.

 2016 Microchip Technology Inc.

DS20005550A-page 11

HV9901