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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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IRF7580MPbF датащи(PDF) 2 Page - International Rectifier |
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IRF7580MPbF датащи(HTML) 2 Page - International Rectifier |
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2 / 11 page  IRF7580MTRPbF 2 www.irf.com © 2014 International Rectifier Submit Datasheet Feedback February 13, 2014 Notes: Mounted on minimum footprint full size board with metalized back and with small clip heatsink. Used double sided cooling , mounting pad with large heatsink. Absolute Maximum Ratings Symbol Parameter Max. Units ID @ TC = 25°C Continuous Drain Current, VGS @ 10V 116 ID @ TC = 100°C Continuous Drain Current, VGS @ 10V 82 A IDM Pulsed Drain Current 460 PD @TC = 25°C Maximum Power Dissipation 115 W Linear Derating Factor 0.78 W/°C VGS Gate-to-Source Voltage ± 20 V TJ Operating Junction and -55 to + 175 °C TSTG Storage Temperature Range Avalanche Characteristics EAS (Thermally limited) Single Pulse Avalanche Energy 100 mJ EAS (tested) Single Pulse Avalanche Energy Tested Value 120 IAR Avalanche Current 70 A EAR Repetitive Avalanche Energy 12 mJ Thermal Resistance Symbol Parameter Typ. Max. Units RJA Junction-to-Ambient ––– 44 RJA Junction-to-Ambient 12.5 ––– RJA Junction-to-Ambient 20 ––– °C/W RJC Junction-to-Case ––– 1.3 RJA-PCB Junction-to-PCB Mounted 0.75 ––– Static @ TJ = 25°C (unless otherwise specified) Symbol Parameter Min. Typ. Max. Units Conditions V(BR)DSS Drain-to-Source Breakdown Voltage 60 ––– ––– V VGS = 0V, ID = 250µA V(BR)DSS/TJ Breakdown Voltage Temp. Coefficient ––– 44 ––– mV/°C Reference to 25°C, ID = 1.0mA RDS(on) Static Drain-to-Source On-Resistance ––– 2.9 3.6 m VGS = 10V, ID = 70A ––– 3.5 ––– m VGS = 6.0V, ID = 35A VGS(th) Gate Threshold Voltage 2.1 ––– 3.7 V VDS = VGS, ID = 150µA IDSS Drain-to-Source Leakage Current ––– ––– 1.0 µA VDS = 60V, VGS = 0V ––– ––– 150 VDS = 60V, VGS = 0V, TJ = 125°C Gate-to-Source Forward Leakage ––– ––– 100 nA VGS = 20V Gate-to-Source Reverse Leakage ––– ––– -100 VGS = -20V RG Internal Gate Resistance ––– 0.8 ––– IGSS TC measured with thermocouple mounted to top (Drain) of part. Surface mounted on 1 in. square Cu board (still air). Mounted to a PCB with small clip heatsink (still air) Mounted on minimum footprint full size board with metalized back and with small clip heatsink (still air) |
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