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IPL60R299CP датащи(PDF) 4 Page - Infineon Technologies AG

номер детали IPL60R299CP
подробное описание детали  Metal Oxide Semiconductor Field Effect Transistor
PDF  13 Pages
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производитель  INFINEON [Infineon Technologies AG]
домашняя страница  http://www.infineon.com
Logo INFINEON - Infineon Technologies AG

IPL60R299CP датащи(HTML) 4 Page - Infineon Technologies AG

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600V CoolMOS™ CP Power Transistor
IPL60R299CP
Maximum ratings
Final Data Sheet
4
Rev. 2.1, 2012-01-10
2
Maximum ratings
at
T
j = 25 °C, unless otherwise specified.
3
Thermal characteristics
Table 2
Maximum ratings
Parameter
Symbol
Values
Unit
Note / Test Condition
Min.
Typ.
Max.
Continuous drain current
1)
1) Limited by
T
j,max. Maximum duty cycle
I
D
--
11.1
A
T
C= 25 °C
7
T
C= 100°C
Pulsed drain current
2)
2) Pulse width
t
p limited by Tj,max
I
D,pulse
--
34
A
T
C=25 °C
Avalanche energy, single pulse
E
AS
--
290
mJ
I
D=4.4 A,VDD=50 V
(see table 17)
Avalanche energy, repetitive
2)3)
3) Repetitive avalanche causes additional power losses that can be calculated as PAV=EAR*f.
E
AR
-
-
0.44
I
D=4.4 A,VDD=50 V
Avalanche current, repetitive
2)3)
I
AR
--
4.4
A
MOSFET dv/dt ruggedness
dv/dt
-
-
50
V/ns
V
DS=0...480 V
Gate source voltage
V
GS
-20
-
20
V
static
-30
30
AC (f>1 Hz)
Power dissipation
P
tot
--
96
W
T
C=25 °C
Operating temperature
T
j
-40
-
150
°C
Storage temperature
T
stg
-40
-
125
°C
Continuous diode forward current
I
S
--
11.1
A
T
C=25 °C
Diode pulse current
2)
I
S,pulse
--
34
A
T
C=25 °C
Reverse diode dv/dt
4)
4) Identical low side and high side switch with identical
R
G
dv/dt
-
-
15
V/ns
V
DS=0...400 V, ISD ID,
T
j=25 °C
Maximum diode commutation
speed
4)
di
f/dt
-
-
200
A/µs
(see table 18)
Table 3
Thermal characteristics
Parameter
Symbol
Values
Unit
Note /
Test Condition
Min.
Typ.
Max.
Thermal resistance, junction - case
R
thJC
--
1.3
°C/W
Thermal resistance, junction -
ambient
R
thJA
-
-
45
SMD version, device
on PCB, 6cm
2 cooling
area
1)
1) Device on 40mm*40mm*1.5mm one layer epoxy PCB FR4 with 6cm
2 copper area (thickness 70µm) for drain connection.
PCB is vertical without air stream cooling.
Reflow soldering temperature
T
sold
-
-
260
°C
reflow MSL 3



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