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STM32L031C6 датащи(PDF) 112 Page - STMicroelectronics

номер детали STM32L031C6
подробное описание детали  Access line ultra-low-power 32-bit MCU ARM-based Cortex-M0, up to 32KB Flash, 8KB SRAM, 1KB EEPROM, ADC
PDF  118 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
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STM32L031C6 датащи(HTML) 112 Page - STMicroelectronics

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Package information
STM32L031x4/6
112/118
DocID027063 Rev 4
7.7
Thermal characteristics
The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated
using the following equation:
TJ max = TA max + (PD max × JA)
Where:
TA max is the maximum ambient temperature in C,
JA is the package junction-to-ambient thermal resistance, in C/W,
PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),
PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip
internal power.
PI/O max represents the maximum power dissipation on output pins where:
PI/O max = (VOL × IOL) + ((VDD – VOH) × IOH),
taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the
application.
Table 77. Thermal characteristics
Symbol
Parameter
Value
Unit
JA
Thermal resistance junction-ambient
LQFP48 - 7 x 7 mm / 0.5 mm pitch
57
°C/W
Thermal resistance junction-ambient
LQFP32 - 7 x 7 mm / 0.8 mm pitch
60
Thermal resistance junction-ambient
UFQFPN32 - 5 x 5 mm / 0.5 mm pitch
39
Thermal resistance junction-ambient
UFQFPN28 - 4 x 4 mm / 0.5 mm pitch
120
Thermal resistance junction-ambient
WLCSP25 - 0.4 mm pitch
70
Thermal resistance junction-ambient
TSSOP20 - 169 mils
60



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