STM32L031C6 datasheet(8/118 Pages) STMICROELECTRONICS

номер детали	STM32L031C6

подробное описание детали	Access line ultra-low-power 32-bit MCU ARM-based Cortex-M0, up to 32KB Flash, 8KB SRAM, 1KB EEPROM, ADC

PDF	118 Pages

Scroll/Zoom	100%

производитель	STMICROELECTRONICS [STMicroelectronics]

домашняя страница	http://www.st.com

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8 / 118 page

List of figures

STM32L031x4/6

8/118

DocID027063 Rev 4

Figure 44.

UFQFPN28 recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105

Figure 45.

Example of UFQFPN28 marking (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105

Figure 46.

WLCSP25 - 2.097 x 2.493 mm, 0.400 mm pitch wafer level chip scale

package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106

Figure 47.

WLCSP25 - 2.097 x 2.493 mm, 0.400 mm pitch wafer level chip scale

recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107

Figure 48.

Example of WLCSP25 marking (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108

Figure 49.

TSSOP20 – 20-lead thin shrink small outline, 6.5 x 4.4 mm, 0.65 mm pitch,

package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109

Figure 50.

TSSOP20 – 20-lead thin shrink small outline, 6.5 x 4.4 mm, 0.65 mm pitch,

package footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110

Figure 51.

Example of TSSOP20 marking (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111

Figure 52.

Thermal resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113

STM32L031C6 датащи(PDF) 8 Page - STMicroelectronics