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Product Data Sheet

SAW9CF2B

– Acrich MJT 3030

 “제품 명 – 제품 군” 을 기입하십시오.

제품 군은 홈페이지 응용분야 분류기준을 참고한다.

(예) SZ5M0WWC9 – High-power LED

24

Font 글씨체

표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body)

– Arial 9pt

 Revision numbering 기준:

• 가스펙은 0.0 부터 시작 0.x….

• Final 승인원: 1.0 부터 시작

• 기존에서 일부 수정: +0.1

• 새로운 Data 추가 /또는 기존 것 삭제: +1.0

 수정일자 표기형식; YYYY-MM-DD

(예) 2013-04-01

Rev 1.0, Nov 29, 2016

Precaution for Use

SSC

표준화결론(개선후)

TOP & SIDETOP & SIDE

MSL (Moisture Sensitive Level)

LEVEL 3

LEVEL 2a

1. Shelf life in Sealing bag

저장기한

(

실링백 상태로)

Months

개월

12

개월

12

개월

Temperature

(maximum)

온도 (이하)

30℃

30℃

Humidity

(maximum)

습도 (미만)

50%RH

50%RH

2. Peak package body temperature

(

제품 최대 온도)

240℃

240℃

3. After this bag is

opened

실링백 개봉 후 조건

hours

시간 (이내)

168 hours

(7days)

672 hours

(28days)

Temperature

(maximum)

온도 (이하)

30℃

30℃

Humidity

(less than)

습도 (미만)-규격

Limit

성격

60%RH

60%RH

Stored

저장조건(미만)

10%RH

10%RH

4. Devices require bake,

before mounting, if:

사용 전 Baking 검사

a. Humiduty

Indicator Card

30%RH

30%RH

Temperature

온도 조건에서

23

±5℃

23

±5℃

b. is not met.

MSL Level (

미만)

3

3

5. If baking is required,

건조(baking) 조건

hours

시간 (이내)

10~24

hours

10~24

hours

Temperature

온도 조건

65

±5℃

65

±5℃

Humidity

(less than)

습도조건 (미만)

10%RH

10%RH

<PKG용>

- 제품에 해당하는 내용 추가 및 수정하십시오.

b. EOS (Electrical Over Stress)

Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is

subjected to a current or voltage that is beyond the maximum specification limits of the device.

The effects from an EOS event can be noticed through product performance like:

- Changes to the performance of the LED package

(If the damage is around the bond pad area and since the package is completely encapsulated

the package may turn on but flicker show severe performance degradation.)

- Changes to the light output of the luminaire from component failure

- Components on the board not operating at determined drive power

Failure of performance from entire fixture due to changes in circuit voltage and current across total

circuit causing trickle down failures. It is impossible to predict the failure mode of every LED exposed

to electrical overstress as the failure modes have been investigated to vary, but there are some

common signs that will indicate an EOS event has occurred:

- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)

- Damage to the bond pads located on the emission surface of the LED package

(shadowing can be noticed around the bond pads while viewing through a microscope)

- Anomalies noticed in the encapsulation and phosphor around the bond wires.

- This damage usually appears due to the thermal stress produced during the EOS event.

c. To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing:

- A surge protection circuit

- An appropriately rated over voltage protection device

- A current limiting device