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Product Data Sheet

SAW9CF2B

– Acrich MJT 3030

 “제품 명 – 제품 군” 을 기입하십시오.

제품 군은 홈페이지 응용분야 분류기준을 참고한다.

(예) SZ5M0WWC9 – High-power LED

17

Font 글씨체

표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body)

– Arial 9pt

 Revision numbering 기준:

• 가스펙은 0.0 부터 시작 0.x….

• Final 승인원: 1.0 부터 시작

• 기존에서 일부 수정: +0.1

• 새로운 Data 추가 /또는 기존 것 삭제: +1.0

 수정일자 표기형식; YYYY-MM-DD

(예) 2013-04-01

Rev 1.0, Nov 29, 2016

Reflow Soldering Characteristics

Caution :

Profile Feature

Sn-Pb Eutectic Assembly

Pb-Free Assembly

3° C/second max.

3° C/second max.

Preheat

100 °C

150 °C

60-120 seconds

150 °C

200 °C

60-180 seconds

Time maintained above:

183 °C

60-150 seconds

217 °C

60-150 seconds

215℃

260℃

Time within 5°C of actual Peak

10-30 seconds

20-40 seconds

Ramp-down Rate

6 °C/second max.

6 °C/second max.

Time 25°C to Peak Temperature

6 minutes max.

8 minutes max.

IPC/JEDEC J-STD-020

(1) Reflow soldering is recommended not to be done more than two times

In the case of more than 24 hours passed soldering after first, LEDs will be damaged.

(2) Repairs should not be done after the LEDs have been soldered

When repair is unavoidable, suitable tools must be used.

(3) Die slug is to be soldered.

(4) When soldering, do not put stress on the LEDs during heating.

(5) After soldering, do not warp the circuit board.