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LM2412 датащи(PDF) 5 Page - National Semiconductor (TI) |
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LM2412 датащи(HTML) 5 Page - National Semiconductor (TI) |
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5 / 11 page ![]() Application Hints (Continued) above 300 MHz. Air core inductors from J.W. Miller Magnet- ics (part #75F518MPC) were used for optimizing the perfor- mance of the device in the NSC application board. The val- ues shown in Figure 9 can be used as a good starting point for the evaluation of the LM2412. Effect of Load Capacitance The output rise and fall times as well as overshoot will vary as the load capacitance varies. The values of the output cir- cuit (R1, R2 and L1 in Figure 9) should be chosen based on the nominal load capacitance. Once this is done the perfor- mance of the design can be checked by varying the load based on what the expected variation will be during produc- tion. Effect of Offset Figure 7 shows the variation in rise and fall times when the output offset of the device is varied from 35 to 55 V DC. The rise and fall times show about the same overall variation. The slightly slower fall time is fastest near the center point of 45V, making this the optimum operating point. At the low and high output offset range, the characteristic of rise/fall time is slower due to the saturation of Q3 and Q4. The recovery time of the output transistors takes longer coming out of saturation thus slows down the rise and fall times. THERMAL CONSIDERATIONS Figure 4 shows the performance of the LM2412 in the test circuit shown in Figure 2 as a function of case temperature. Figure 4 shows that both the rise and fall times of the LM2412 become slightly longer as the case temperature in- creases from 40˚C to 125˚C. In addition to exceeding the safe operating temperature, the rise and fall times will typi- cally exceed 3 nsec. Please note that the LM2412 is never to be operated over a case temperature of 100˚C. In addi- tion to exceeding the safe operating temperature, the rise and fall times will typically exceed 3 nsec. Figure 6 shows the total power dissipation of the LM2412 vs. Frequency when all three channels of the device are driving an 8 pF load. Typically the active time is about 72% of the to- tal time for one frame. Worst case power dissipation is when a one on, one off pixel is displayed over the active time of the video input. This is the condition used to measure the total power disspation of the LM2412 at different input frequen- cies. Figure 6 gives all the information a monitor designer normally needs for worst case power dissipation. However, if the designer wants to calculate the power dissipation for an active time different from 72%, this can be done using the in- formation in Figure 14. The recommended input black level voltage is 1.9V. From Figure 14, if a 1.9V input is used for the black level, then power dissipation during the inactive video time is 2.7W. This includes both the 80V and 12V sup- plies. If the monitor designer chooses to calculate the power dissi- pation for the LM2412 using an active video time different from 72%, then he needs to use the following steps when us- ing a 1.9V input black level: 1. Multiply the black level power dissipation, 2.7W, by 0.28, the result is 0.8W. 2. Choose the maximum frequency to be used. A typical application would use 100 MHz, or a 200 MHz pixel clock. The power dissipation is 13.8W. 3. Subtract the 0.8W from the power dissipation from Fig- ure 6. For 100 MHz this would be 13.8 – 0.8 = 13.0W. 4. Divide the result from step 3 by 0.72. For 100 MHz, the result is 18.1W. 5. Multiply the result in 4 by the new active time percent- age. 6. Multiply 2.7W by the new inactive time. 7. Add together the results of steps 5 and 6. This is the ex- pected power dissipation for the LM2412 in the design- er’s application. The LM2412 case temperature must be maintained below 100˚C. If the maximum expected ambient temperature is 70˚C and the maximum power dissipation is 13.8W (from Figure 6. 100MHz) then a maximum heat sink thermal resis- tance can be calculated: TYPICAL APPLICATION A typical application of the LM2412 is shown in Figure 10. Used in conjunction with three LM2202s, a complete video channel from monitor input to CRT cathode can be achieved. Performance is excellent for resolutions up to 1600 x 1200 and pixel clock frequencies at 200 MHz. Figure 10 is the schematic for the NSC demonstration board that can be used to evaluate the LM2202/LM2412 combination in a monitor. PC Board Layout Considerations For optimum performance, an adequate ground plane, isola- tion between channels, good supply bypassing and minimiz- ing unwanted feedback are necessary. Also, the length of the signal traces from the preamplifier to the LM2412 and from the LM2412 to the CRT cathode should be as short as pos- sible. The red video trace from the buffer transistor to the LM2412 input is about the absolute maximum length one should consider on a PCB layout. If possible the traces should actually be shorter than the red video trace. The fol- lowing references are recommended for video board design- ers: Ott, Henry W., “Noise Reduction Techniques in Electronic Systems”, John Wiley & Sons, New York, 1976. “Guide to CRT Video Design”, National Semiconductor Appli- cation Note 861. “Video Amplifier Design for Computer Monitors”, National Semiconductor Application Note 1013. Pease, Robert A., “Troubleshooting Analog Circuits”, Butterworth-Heinemann, 1991. Because of its high small signal bandwidth, the part may os- cillate in a monitor if feedback occurs around the video chan- nel through the chassis wiring. To prevent this, leads to the video amplifier input circuit should be shielded, and input cir- cuit wiring should be spaced as far as possible from output circuit wiring. NSC Demonstration Board Figures 11, 12 show routing and component placement on the NSC LM2202/2412 demonstration board. The schematic of the board is shown in Figure 10. This board provides a good example of a layout that can be used as a guide for fu- ture layouts. Note the location of the following components: • C47 -V CC bypass capacitor, located very close to pin 6 and ground pins. ( Figure 12) • C49 -V BB bypass capacitor, located close to pin 10 and ground. ( Figure 12) www.national.com 5 |
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