TFP501

PanelBus

 HDCP DIGITAL RECEIVER

SLDS127B – JULY 2001 – REVISED AUGUST 2002

21

POST OFFICE BOX 655303

Data

A

S

Slave Address

Sub Address

A

WSr

A

P

From Transmitter

From Receiver

Sr Restart Condition

A

Acknowledge

S

Start Condition

P

Stop Condition

A

RA

Slave Address

Data

A

Not Acknowledge (SDA High)

W

Write

R

Read

Data

S

Slave Address

R

P

From Transmitter

From Receiver

R

Read

A

Acknowledge

S

Start Condition

P

Stop Condition

A

A

Not Acknowledge (SDA High)

A

Data

A

Figure 20. HDCP Port Link Integrity Message Read

PowerPAD 100-pin TQFP package

The TFP501 is packaged in TI’s thermally enhanced PowerPAD 100-pin TQFP packaging. The PowerPAD

package is a 14 mm

× 14 mm × 1 mm TQFP outline with 0.5mm lead-pitch. The PowerPAD package has a

specially designed die mount pad that offers improved thermal capability over typical TQFP packages of the

same outline. The TI 100-pin TQFP PowerPAD package offers a backside solder plane that connects directly

to the die mount pad for enhanced thermal conduction. Soldering the backside of the TFP501 to the application

board is not required thermally, as the device power dissipation is well within the package capability when not

soldered.

Soldering the backside of the device to the PCB ground plane is recommended for electrical considerations.

Since the die pad is electrically connected to the chip substrate and hence chip ground, connection of the

PowerPAD back side to a PCB ground plane helps to improve EMI, ground bounce, and power supply noise

performance.

The following table outlines the thermal properties of the TI 100-pin TQFP PowerPAD package. The 100-pin

TQFP non-PowerPAD package is included only for reference.

Table 1. TI 100-Pin TQFP (14

× 14 × 1 mm)/0.5 mm Lead Pitch

PARAMETER

WITHOUT

PowerPAD

PowerPAD

NOT CONNECTED

TO PCB THERMAL

PLANE

PowerPAD

CONNECTED TO PCB

THERMAL PLANE

(see Note 14)

R

θJA

Junction-to-ambient thermal resistance (see Notes 14 and 15)

49.17

°C/W

27.32

°C/W

17.28

°C/W

R

θJC Junction-to-case thermal resistance (see Notes 14 and 15)

3.11

°C/W

0.12

°C/W

0.12

°C/W

PD

Package power dissipation (see Notes 14, 15 and 16)

1.6 W

2.9 W

4.6 W

NOTES: 15. Specified with the PowerPAD bond pad on the backside of the package soldered to a 2 oz Cu plate PCB thermal plane.

16. Airflow is at 0 LFM (no airflow).

17. Specified at 150

°C junction temperature and 70°C ambient temperature.