6

TLV376, TLV2376, TLV4376

SBOS755 – OCTOBER 2016

www.ti.com

Product Folder Links: TLV376 TLV2376 TLV4376

Submit Documentation Feedback

Copyright © 2016, Texas Instruments Incorporated

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information: TLV376

TLV376

UNIT

D (SOIC)

DBV (SOT-23)

8 PINS

5 PINS

Junction-to-ambient thermal resistance

100.1

273.8

°C/W

Junction-to-case (top) thermal resistance

42.4

126.8

°C/W

Junction-to-board thermal resistance

41.0

85.9

°C/W

Junction-to-top characterization parameter

4.8

10.9

°C/W

Junction-to-board characterization parameter

40.3

84.9

°C/W

Junction-to-case (bottom) thermal resistance

n/a

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Thermal Information: TLV2376

TLV2376

UNIT

D (SOIC)

DGK (VSSOP)

8 PINS

8 PINS

Junction-to-ambient thermal resistance

111.1

171.2

°C/W

Junction-to-case (top) thermal resistance

54.7

63.9

°C/W

Junction-to-board thermal resistance

51.7

92.8

°C/W

Junction-to-top characterization parameter

10.5

9.2

°C/W

Junction-to-board characterization parameter

51.2

91.2

°C/W

Junction-to-case (bottom) thermal resistance

n/a

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.6 Thermal Information: TLV4376

TLV4376

UNIT

PW (TSSOP)

14 PINS

Junction-to-ambient thermal resistance

107.8

°C/W

Junction-to-case (top) thermal resistance

29.6

°C/W

Junction-to-board thermal resistance

52.6

°C/W

Junction-to-top characterization parameter

1.5

°C/W

Junction-to-board characterization parameter

51.6

°C/W

Junction-to-case (bottom) thermal resistance

n/a

°C/W