CAP1214 datasheet(14/107 Pages) MICROCHIP

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Multiple Channel Capacitive Touch Sensor and LED Driver

Datasheet

Revision 1.0 (08-30-10)

SMSC CAP1214

DATASHEET

Chapter 3 Electrical Specifications

Note: Stresses above those listed could cause permanent damage to the device. This is a stress

rating only and functional operation of the device at any other condition above those indicated

in the operation sections of this specification is not implied.

Note 3.1

For the 5V tolerant pins that have a pull-up resistor, the pull-up voltage must not exceed

3.6V when the device is unpowered.

Note 3.2

The Package Power Dissipation specification assumes a thermal via design with the

thermal landing be soldered to the PCB ground plane with 0.3mm (12mil) diameter vias in

a 4x4 matrix at 0.9mm (35.4mil) pitch.

Note 3.3

Junction to Ambient (

θJA) is dependent on the design of the thermal vias. Without thermal

vias and a thermal landing, the

θJA is approximately 60°C/W including localized PCB

temperature increase.

Table 3.1 Absolute Maximum Ratings

Voltage on VDD pin

-0.3 to 4

Voltage on 5V tolerant pins (V5VT_PIN)

-0.3 to 5.5

Voltage on 5V tolerant pins (|V5VT_PIN - VDD|) (see Note 3.1)0 to 3.6

Voltage on any other pin to GND

-0.3 to VDD + 0.3

Package Power Dissipation up to TA = 85°C (see Note 3.2)1

Junction to Ambient (

θJA) (see Note 3.3)48

°C/W

Operating Ambient Temperature Range

-40 to 125

°C

Storage Temperature Range

-55 to 150

°C

ESD Rating, All Pins, HBM

8000

Table 3.2 Electrical Specifications

VDD = 3V to 3.6V, TA = 0°C to 85°C, all Typical values at TA = 27°C unless otherwise noted.

CHARACTERISTIC

SYMBOL

MIN

TYP

MAX

UNIT

CONDITIONS

DC Power

Supply Voltage

VDD

3.0

3.3

3.6

Supply Current

IDD

0.55

Average current

Capacitive Sensing Active,

LEDs enabled

ISLEEP

250

400

Sleep state active, 1 sensor

monitored; LED11 inactive

TA < 85°C

IDSLEEP

4.5

Deep Sleep, LED 11 inactive

TA < 40°C

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