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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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PIC16F5X датащи(PDF) 81 Page - Microchip Technology |
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PIC16F5X датащи(HTML) 81 Page - Microchip Technology |
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81 / 90 page  2004 Microchip Technology Inc. DS41213C-page 79 PIC16F5X 28-Lead Plastic Shrink Small Outline (SS) – 209 mil, 5.30 mm (SSOP) 0.38 - 0.22 .015 - .009 B Lead Width 8° 4° 0° 8° 4° 0° f Foot Angle 0.25 - 0.09 .010 - .004 c Lead Thickness 0.95 0.75 0.55 .037 .030 .022 L Foot Length 10.50 10.20 9.90 .413 .402 .390 D Overall Length 5.60 5.30 5.00 .220 .209 .009 E1 Molded Package Width 8.20 7.80 7.49 .323 .307 .295 E Overall Width - - 0.05 - - .002 A1 Standoff 1.85 1.75 1.65 .073 .069 .065 A2 Molded Package Thickness 2.0 - - .079 - - A Overall Height 0.65 .026 p Pitch 28 28 n Number of Pins MAX NOM MIN MAX NOM MIN Dimension Limits MILLIMETERS* INCHES Units 2 1 D p n B E1 E L c f A2 A1 A shall not exceed .010" (0.254mm) per side. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions Notes: JEDEC Equivalent: MO-150 Drawing No. C04-073 *Controlling Parameter |
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