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DMNH6021SPD датащи(PDF) 2 Page - Diodes Incorporated |
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DMNH6021SPD датащи(HTML) 2 Page - Diodes Incorporated |
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2 / 7 page ![]() DMNH6021SPD Document number: DS37392 Rev. 3 - 2 2 of 7 www.diodes.com June 2016 © Diodes Incorporated DMNH6021SPD Maximum Ratings (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Units Drain-Source Voltage VDSS 60 V Gate-Source Voltage VGSS ±20 V Continuous Drain Current (Note 6) VGS = 10V TA = +25°C TA = +70°C ID 8.2 6.5 A Continuous Drain Current (Note 7) VGS = 10V TC = +25°C TC = +100°C ID 32 22 A Pulsed Drain Current (380µs Pulse, Duty Cycle = 1%) IDM 80 A Maximum Continuous Body Diode Forward Current (Note 7) IS 32 A Avalanche Current, L = 0.1mH (Note 8) IAS 35 A Avalanche Energy, L = 0.1mH (Note 8) EAS 64 mJ Thermal Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Units Total Power Dissipation (Note 5) PD 1.5 W Thermal Resistance, Junction to Ambient (Note 5) Steady State RθJA 99 °C/W t<10s 53 Total Power Dissipation (Note 6) PD 2.8 W Thermal Resistance, Junction to Ambient (Note 6) Steady State RθJA 54 °C/W t<10s 27 Thermal Resistance, Junction to Case (Note 7) RθJC 2.2 °C/W Operating and Storage Temperature Range TJ, TSTG -55 to +175 °C Electrical Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Min Typ Max Unit Test Condition OFF CHARACTERISTICS (Note 9) Drain-Source Breakdown Voltage BVDSS 60 — — V VGS = 0V, ID = 250μA Zero Gate Voltage Drain Current TJ = +25°C IDSS — — 1 µA VDS = 60V, VGS = 0V Gate-Source Leakage IGSS — — ±100 nA VGS = ±20V, VDS = 0V ON CHARACTERISTICS (Note 9) Gate Threshold Voltage VGS(TH) 1 — 3 V VDS = VGS, ID = 250μA Static Drain-Source On-Resistance RDS(ON) — 15 25 m Ω VGS = 10V, ID = 15A — 21 40 VGS = 4.5V, ID = 12A Diode Forward Voltage VSD — 0.75 1.2 V VGS = 0V, IS = 2.6A DYNAMIC CHARACTERISTICS (Note 10) Input Capacitance CISS — 1,143 — pF VDS = 25V, VGS = 0V, f = 1MHz Output Capacitance COSS — 168 — pF Reverse Transfer Capacitance CRSS — 69 — pF Gate Resistance RG — 2.1 — Ω VDS = 0V, VGS = 0V, f = 1MHz Total Gate Charge (VGS = 10V) QG — 20.1 — nC VDS = 30V, ID = 20A, Total Gate Charge (VGS = 6V) QG — 12 — nC Gate-Source Charge QGS — 4.3 — nC Gate-Drain Charge QGD — 5.5 — nC Turn-On Delay Time tD(ON) — 4.4 — ns VDD = 30V, VGS = 10V, RG = 4.7Ω, , ID = 20A Turn-On Rise Time tR — 6.0 — ns Turn-Off Delay Time tD(OFF) — 14.2 — ns Turn-Off Fall Time tF — 5.4 — ns Body Diode Reverse Recovery Time tRR — 21.2 — ns IF=20A, di/dt=1 00A/μs Body Diode Reverse Recovery Charge QRR — 15.2 — nC Notes: 5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided. 6. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate. 7. Thermal resistance from junction to soldering point (on the exposed drain pad). 8. IAS and EAS rating are based on low frequency and duty cycles to keep TJ = 25°C 9. Short duration pulse test used to minimize self-heating effect. 10. Guaranteed by design. Not subject to product testing. |
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