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DMNH6021SPD датащи(PDF) 2 Page - Diodes Incorporated

номер детали DMNH6021SPD
подробное описание детали  60V 175째C DUAL N-CHANNEL ENHANCEMENT MODE MOSFET PowerDI
PDF  7 Pages
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производитель  DIODES [Diodes Incorporated]
домашняя страница  http://www.diodes.com
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DMNH6021SPD датащи(HTML) 2 Page - Diodes Incorporated

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DMNH6021SPD
Document number: DS37392 Rev. 3 - 2
2 of 7
www.diodes.com
June 2016
© Diodes Incorporated
DMNH6021SPD
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Units
Drain-Source Voltage
VDSS
60
V
Gate-Source Voltage
VGSS
±20
V
Continuous Drain Current (Note 6) VGS = 10V
TA = +25°C
TA = +70°C
ID
8.2
6.5
A
Continuous Drain Current (Note 7) VGS = 10V
TC = +25°C
TC = +100°C
ID
32
22
A
Pulsed Drain Current (380µs Pulse, Duty Cycle = 1%)
IDM
80
A
Maximum Continuous Body Diode Forward Current (Note 7)
IS
32
A
Avalanche Current, L = 0.1mH (Note 8)
IAS
35
A
Avalanche Energy, L = 0.1mH (Note 8)
EAS
64
mJ
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Units
Total Power Dissipation (Note 5)
PD
1.5
W
Thermal Resistance, Junction to Ambient (Note 5)
Steady State
RθJA
99
°C/W
t<10s
53
Total Power Dissipation (Note 6)
PD
2.8
W
Thermal Resistance, Junction to Ambient (Note 6)
Steady State
RθJA
54
°C/W
t<10s
27
Thermal Resistance, Junction to Case (Note 7)
RθJC
2.2
°C/W
Operating and Storage Temperature Range
TJ, TSTG
-55 to +175
°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
OFF CHARACTERISTICS (Note 9)
Drain-Source Breakdown Voltage
BVDSS
60
V
VGS = 0V, ID = 250μA
Zero Gate Voltage Drain Current TJ = +25°C
IDSS
1
µA
VDS = 60V, VGS = 0V
Gate-Source Leakage
IGSS
±100
nA
VGS = ±20V, VDS = 0V
ON CHARACTERISTICS (Note 9)
Gate Threshold Voltage
VGS(TH)
1
3
V
VDS = VGS, ID = 250μA
Static Drain-Source On-Resistance
RDS(ON)
15
25
m
VGS = 10V, ID = 15A
21
40
VGS = 4.5V, ID = 12A
Diode Forward Voltage
VSD
0.75
1.2
V
VGS = 0V, IS = 2.6A
DYNAMIC CHARACTERISTICS (Note 10)
Input Capacitance
CISS
1,143
pF
VDS = 25V, VGS = 0V,
f = 1MHz
Output Capacitance
COSS
168
pF
Reverse Transfer Capacitance
CRSS
69
pF
Gate Resistance
RG
2.1
VDS = 0V, VGS = 0V, f = 1MHz
Total Gate Charge (VGS = 10V)
QG
20.1
nC
VDS = 30V, ID = 20A,
Total Gate Charge (VGS = 6V)
QG
12
nC
Gate-Source Charge
QGS
4.3
nC
Gate-Drain Charge
QGD
5.5
nC
Turn-On Delay Time
tD(ON)
4.4
ns
VDD = 30V, VGS = 10V,
RG = 4.7Ω, , ID = 20A
Turn-On Rise Time
tR
6.0
ns
Turn-Off Delay Time
tD(OFF)
14.2
ns
Turn-Off Fall Time
tF
5.4
ns
Body Diode Reverse Recovery Time
tRR
21.2
ns
IF=20A, di/dt=1
00A/μs
Body Diode Reverse Recovery Charge
QRR
15.2
nC
Notes:
5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate.
7. Thermal resistance from junction to soldering point (on the exposed drain pad).
8. IAS and EAS rating are based on low frequency and duty cycles to keep TJ = 25°C
9. Short duration pulse test used to minimize self-heating effect.
10. Guaranteed by design. Not subject to product testing.



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