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TMS570LS3134 датащи(PDF) 39 Page - Texas Instruments

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номер детали TMS570LS3134
подробное описание детали  TMS570LS31x4/21x4 16- and 32-Bit RISC Flash Microcontroller
PDF  167 Pages
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производитель  TI1 [Texas Instruments]
домашняя страница  http://www.ti.com
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TMS570LS3134 датащи(HTML) 39 Page - Texas Instruments

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TMS570LS3134, TMS570LS2134, TMS570LS2124
www.ti.com
SPNS165B – APRIL 2012 – REVISED MAY 2015
5
Specifications
5.1
Absolute Maximum Ratings
(1)
Over Operating Free-Air Temperature Range
MIN
MAX
UNIT
VCC
(2)
–0.3
1.43
Supply voltage
VCCIO, VCCP
(2)
–0.3
4.6
V
VCCAD
–0.3
6.25
All input pins
–0.3
4.6
Input voltage
V
ADC input pins
–0.3
6.25
IIK (VI < 0 or VI > VCCIO)
–20
20
All pins, except AD1IN[23:0] and AD2IN[15:0]
mA
Input clamp current
IIK (VI < 0 or VI > VCCAD)
–10
10
AD1IN[23:0] and AD2IN[15:0]
Total
–40
40
mA
Operating free-air temperature, TA:
–40
125
°C
Operating junction temperature, TJ:
–40
150
°C
Storage temperature, Tstg
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
Maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to their associated
grounds.
5.2
ESD Ratings
VALUE
UNIT
Human body model (HBM), per AEC Q100-002(1)
±2
kV
All pins
±500
Electrostatic discharge
Corner pins on 144-pin PGE
VESD
Charged device model (CDM),
±750
(ESD) performance:
(1, 36, 37, 72, 73, 108, 109, 144)
V
per AEC Q100-011
Corner balls on 337-ball ZWT
±750
(A1, A19, W1, W19)
(1)
AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS
‑001 specification.
5.3
Power-On Hours (POH)
(1) (2)
JUNCTION
NOMINAL CORE VOLTAGE (VCC)
LIFETIME POH
TEMPERATURE (Tj)
1.2
105ºC
100K
(1)
This information is provided solely for your convenience and does not extend or modify the warranty provided under TI's standard terms
and conditions for TI semiconductor products.
(2)
To avoid significant degradation, the device power-on hours (POH) must be limited to those specified in this table. To convert to
equivalent POH for a specific temperature profile, see the Calculating Equivalent Power-on-Hours for Hercules Safety MCUs Application
Report (SPNA207).
Copyright © 2012–2015, Texas Instruments Incorporated
Specifications
39
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