 2015 Microchip Technology Inc.

DS20005461A-page 15

HV583

RECOMMENDED LAND PATTERN

Dimension Limits

Units

C2

Contact Pad Spacing

Contact Pitch

MILLIMETERS

0.75 BSC

MIN

E

MAX

9.00

Contact Pad Diameter (X169)

b

0.35

Microchip Technology Drawing C04-2377-J Rev C

NOM

SILK SCREEN

C1

Contact Pad Spacing

9.00

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

1.

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

E

Øb

C1

C2

1

2

3456789

10

11

12

13

A

B

C

D

E

F

G

H

J

K

L

M

N

169-Ball Thin Fine Pitch Ball Grid Array (7G) - 10x10x1.10 mm Body [TFBGA]

(Complies with JEDEC Terminal Assignment recommendations)