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MCP16301HT-E/CH датащи(PDF) 20 Page - Microchip Technology

номер детали MCP16301HT-E/CH
подробное описание детали  High-Voltage Input Integrated Switch Step-Down Regulator
PDF  40 Pages
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производитель  MICROCHIP [Microchip Technology]
домашняя страница  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MCP16301HT-E/CH датащи(HTML) 20 Page - Microchip Technology

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MCP16301/H
DS20005004D-page 20
 2011-2015 Microchip Technology Inc.
5.9
Boost Capacitor
The boost capacitor is used to supply current for the
internal high-side drive circuitry that is above the input
voltage. The boost capacitor must store enough energy
to completely drive the high-side switch on and off. A
0.1 µF X5R or X7R capacitor is recommended for all
applications. The boost capacitor maximum voltage is
5.5V, so a 6.3V or 10V rated capacitor is
recommended. In case of a noise-sensitive application,
an additional resistor in series with the boost capacitor,
that will reduce the high-frequency noise associated
with switching power supplies, can be added. A typical
value for the resistor is 82
.
5.10
Thermal Calculations
The MCP16301/H devices are available in a SOT-23-6
package. By calculating the power dissipation and
applying the package thermal resistance (
JA), the
junction temperature is estimated. The maximum
continuous junction temperature rating for the
MCP16301/H devices is +125°C.
To quickly estimate the internal power dissipation for
the switching step-down regulator, an empirical
calculation using measured efficiency can be used.
Given the measured efficiency, the internal power
dissipation is estimated by Equation 5-7. This power
dissipation
includes
all
internal
and
external
component losses. For a quick internal estimate,
subtract the estimated Schottky diode loss and inductor
ESR loss from the PDIS calculation in Equation 5-7.
EQUATION 5-7:
TOTAL POWER
DISSIPATION ESTIMATE
The difference between the first term, input power, and
the second term, power delivered, is the total system
power dissipation. The freewheeling Schottky diode
losses are determined by calculating the average diode
current and multiplying by the diode forward drop. The
inductor losses are estimated by PL =IOUT2 xLESR.
EQUATION 5-8:
DIODE POWER
DISSIPATION ESTIMATE
EXAMPLE 5-5:
5.11
PCB Layout Information
Good printed circuit board layout techniques are
important to any switching circuitry, and switching
power supplies are no different. When wiring the
switching high-current paths, short and wide traces
should be used. Therefore, it is important that the input
and output capacitors be placed as close as possible to
the MCP16301/H devices to minimize the loop area.
The feedback resistors and feedback signal should be
routed away from the switching node and the switching
current loop. When possible, ground planes and traces
should be used to help shield the feedback signal and
minimize noise and magnetic interference.
A good MCP16301/H layout starts with CIN placement.
CIN supplies current to the input of the circuit when the
switch is turned on. In addition to supplying
high-frequency switch current, CIN also provides a
stable voltage source for the internal MCP16301/H
circuitry. Unstable PWM operation can result if there
are excessive transients or ringing on the VIN pin of the
MCP16301/H devices. In Figure 5-1, CIN is placed
close to pin 5. A ground plane on the bottom of the
board provides a low resistive and inductive path for
the return current. The next priority in placement is the
freewheeling current loop formed by D1, COUT and L,
while strategically placing COUT return close to CIN
return. Next, CB and DB should be placed between the
boost pin and the switch node pin SW. This leaves
space close to the VFB pin of the MCP16301/H devices
to place RTOP and RBOT. RTOP and RBOT are routed
away from the Switch node so noise is not coupled into
the high-impedance VFB input.
VOUT IOUT
Efficiency
-------------------------------


VOUT IOUT

PDis
=
PDiode
VF
1D
 I
OUT

=
VIN
=10V
VOUT
=5V
IOUT
=0.4A
Efficiency
= 90%
Total System Dissipation
= 222 mW
LESR
=0.15
PL
=24 mW
Diode VF
= 0.50
D= 50%
PDiode
=125 mW
MCP16301/H internal power dissipation estimate:
PDIS -PL -PDIODE =73mW
JA
=198°C/W
Estimated Junction
Temperature Rise
=+14.5°C



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