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DS3885 датащи(PDF) 5 Page - National Semiconductor (TI) |
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DS3885 датащи(HTML) 5 Page - National Semiconductor (TI) |
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5 / 12 page ![]() AC Electrical Characteristics TA e 0 Cto a70 C VCC e 5V g10% (Note 6) (Continued) Symbol Parameter Conditions Min Typ Max Units PARAMETERS NOT TESTED Coutput Capacitance at Bn (Note 7) 5 pF tNR Noise Rejection (Note 8) 1 ns Note 6 All input risefall times should be 3 ns Note 7 This parameter is tested using TDR techniques described in 11940 BTL Backplane Design Guide Note 8 This parameter is tested during device characterization The measurement revealed that the part will typically reject 1 ns pulse width Pin Description Pin Name Number of Input Description Pins Output ALL1 1 O TTLAll asserted (A logic ‘‘1’’ indicates that all the competition bits are asserted) ABk70l 8 IO BTLFuturebusa Wired-OR competition bits ABP 1 IO BTLFuturebusa Wired-OR competition parity bit ABk70l and 9 NA Parallel driver grounds reduce ground bounce due to high current switching of driver outputs (Note 9) ABP GND CNk70l 8 IO TTL TRI-STATEModule competition bits CNP 1 I TTL TRI-STATEModule competition parity bit CMPT 1 I TTLCompetition bit (A logic ‘‘0’’ indicates that the module will compete in the arbitration) GND 3 NA Ground for switching circuits (Note 9) CN LE 1 I TTLCNn latch enable (A logic ‘‘0’’ indicates that the CNknl logic states are latched with corresponding parity bit) LI 1 NA Power supply for live insertion Boards that require live insertion should connect LI to the live insertion pin on the connector (Note 10) NC 3 NA No connect PER 1 O TTLABn odd parity (A logic ‘‘0’’ indicates parity error) AB RE 1 I TTLReceiver Enable (A logic ‘‘0’’ enables receivers) QGND 1 NA Ground for receiver input bandgap reference and non-switching circuits (Note 9) QVCC 1NA VCC supply for bandgap reference and non-switching circuits (Note 2) VCC 2NA VCC supply for switching circuits (Note 10) WIN GT 1 O TTLWin signal (active low) During competition WIN GT indicates that the module has won the competition For a module not participating in the competition WIN GT indicates that the module has a number which is greater than winner’s number Note 9 The multiplicity of parallel ground paths reduces the effective inductance of bonding wires and leads which then reduces the noise caused by transients on the ground path The various ground pins can be tied together provided that the external ground has low inductance (ie ground plane with power pins and many signal pins connected to the backplane ground) If the external ground floats considerably during transients precautionary steps should be taken to prevent QGND from moving with reference to the backplane ground The receiver threshold should have the same ground reference as the signal coming from the backplane A voltage offset between their grounds will degrade the noise margin Note 10 The same considerations for ground are used for VCC in reducing lead inductance (See Note 9) QVCC and VCC should be tied together externally If live insertion is not supported the LI pin can be tied together with QVCC and VCC 5 |
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