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DS3885 датащи(PDF) 5 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
номер детали DS3885
подробное описание детали  BTL Arbitration Transceiver
PDF  12 Pages
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производитель  NSC [National Semiconductor (TI)]
домашняя страница  http://www.national.com
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DS3885 датащи(HTML) 5 Page - National Semiconductor (TI)

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AC Electrical Characteristics TA e 0 Cto a70 C VCC e 5V g10% (Note 6) (Continued)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
PARAMETERS NOT TESTED
Coutput
Capacitance at Bn
(Note 7)
5
pF
tNR
Noise Rejection
(Note 8)
1
ns
Note 6
All input risefall times should be 3 ns
Note 7
This parameter is tested using TDR techniques described in 11940 BTL Backplane Design Guide
Note 8
This parameter is tested during device characterization The measurement revealed that the part will typically reject 1 ns pulse width
Pin Description
Pin Name
Number of
Input
Description
Pins
Output
ALL1
1
O
TTLAll asserted (A logic ‘‘1’’ indicates that all the competition bits
are asserted)
ABk70l
8
IO
BTLFuturebusa Wired-OR competition bits
ABP
1
IO
BTLFuturebusa Wired-OR competition parity bit
ABk70l and
9
NA
Parallel driver grounds reduce ground bounce due to high current
switching of driver outputs (Note 9)
ABP GND
CNk70l
8
IO
TTL TRI-STATEModule competition bits
CNP
1
I
TTL TRI-STATEModule competition parity bit
CMPT
1
I
TTLCompetition bit (A logic ‘‘0’’ indicates that the module will
compete in the arbitration)
GND
3
NA
Ground for switching circuits (Note 9)
CN
LE
1
I
TTLCNn latch enable (A logic ‘‘0’’ indicates that the CNknl
logic states are latched with corresponding parity bit)
LI
1
NA
Power supply for live insertion Boards that require live insertion
should connect LI to the live insertion pin on the connector
(Note 10)
NC
3
NA
No connect
PER
1
O
TTLABn odd parity (A logic ‘‘0’’ indicates parity error)
AB
RE
1
I
TTLReceiver Enable (A logic ‘‘0’’ enables receivers)
QGND
1
NA
Ground for receiver input bandgap reference and non-switching
circuits (Note 9)
QVCC
1NA
VCC supply for bandgap reference and non-switching circuits
(Note 2)
VCC
2NA
VCC supply for switching circuits (Note 10)
WIN
GT
1
O
TTLWin signal (active low) During competition WIN
GT
indicates that the module has won the competition For a module
not participating in the competition WIN
GT indicates that the
module has a number which is greater than winner’s number
Note 9
The multiplicity of parallel ground paths reduces the effective inductance of bonding wires and leads which then reduces the noise caused by transients
on the ground path The various ground pins can be tied together provided that the external ground has low inductance (ie ground plane with power pins and
many signal pins connected to the backplane ground) If the external ground floats considerably during transients precautionary steps should be taken to prevent
QGND from moving with reference to the backplane ground The receiver threshold should have the same ground reference as the signal coming from the
backplane A voltage offset between their grounds will degrade the noise margin
Note 10
The same considerations for ground are used for VCC in reducing lead inductance (See Note 9) QVCC and VCC should be tied together externally If live
insertion is not supported the LI pin can be tied together with QVCC and VCC
5



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