LP8555 datasheet(4/64 Pages) TI1

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LP8555

SNVS857 – FEBRUARY 2014

www.ti.com

7 Specifications

7.1 Absolute Maximum Ratings

(1)

Over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VDD

Voltage on VDD

–0.3

VLDO

Voltage on VLDO

V(PWM/INT,

–0.3

EN/VDDIO/

Voltage on logic terminals

FSET/SDA,

ISET/SCL)

V(SW_A, SW_B,

Voltage on analog terminals

–0.3

LEDxy, FB_x)

Internally

Continuous Power Dissipation (2)

limited

Operating ambient temperature range (3)

–40

Maximum operating junction temperature (3)

–40

125

°C

Tsoldering

Note (4)

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.

(2)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typ.) and

disengages at TJ = 137°C (typ.).

(3)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be degraded. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP

= 125ºC), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the

part/package in the application (

θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX).

(4)

For detailed soldering specifications and information, please refer to Application Note AN1112.

7.2 Handling Ratings

MIN

MAX

UNIT

TSTORAGE

Storage temp range

–65

150

°C

VHBM

Human body model (HBM) voltage(1)

2000

VCDM

Charged device model (CDM) (2)

250

(1)

Level listed above is the passing level per ANSI/ESDA/JEDEC JS-001. JEDEC document JEP155 states that 500-V HBM allows safe

manufacturing with a standard ESD control process. Terminals listed as 2 kV may actually have higher performance.

(2)

Level listed above is the passing level per EIA-JEDEC JESD22-C101. JEDEC document JEP157 states that 250-V CDM allows safe

manufacturing with a standard ESD control process. Terminals listed as 250 V may actually have higher performance

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