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LP2986 датащи(PDF) 3 Page - Texas Instruments

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номер детали LP2986
подробное описание детали  Micropower, 200-mA Ultra-Low-Dropout Fixed or Adjustable Voltage Regulator
PDF  33 Pages
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производитель  TI1 [Texas Instruments]
домашняя страница  http://www.ti.com
Logo TI1 - Texas Instruments

LP2986 датащи(HTML) 3 Page - Texas Instruments

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background image
GROUND
2
3
4
5
6
7
8
1
FEEDBACK
TAP
IN
OUT
SENSE
Exposed Pad
on Bottom
(DAP)
SHUTDOWN
ERROR
GROUND
FEEDBACK
TAP
IN
SENSE
OUT
1
2
3
4
8
7
6
5
SHUTDOWN
ERROR
GROUND
FEEDBACK
TAP
IN
SENSE
OUT
1
2
3
4
8
7
6
5
SHUTDOWN
ERROR
LP2986
www.ti.com
SNVS137I – MARCH 1999 – REVISED SEPTEMBER 2015
5 Pin Configuration and Function
D Package
DGK Package
8-Pin SOIC
8-Pin VSSOP
Top View
Top View
NGN Package
8-Pin WSON
Top View
See WSON Mounting.
Pin Functions: All Packages
PIN
I/O
DESCRIPTION
NAME
NO.
Active-low open-collector error output. Goes low when VOUT drops by 5% of its
ERROR
7
O
nominal value.
Determines the output voltage. Connect to TAP (with OUT tied to SENSE) to output
FEEDBACK
2
I
the fixed voltage corresponding to the part version, or connect to a resistor divider to
adjust the output voltage (see Typical Applications).
GROUND
1
—
Ground.
IN
4
I
Input voltage supply.
OUT
5
O
Regulated output.
Connect to OUT (with FEEDBACK tied to TAP) to output the voltage corresponding to
SENSE
6
I
the part version (see Typical Applications).
SHUTDOWN
8
I
Active-high. pull low to showdown the output voltage.
Middle tap of the Internal voltage divider. Tie to FEEDBACK (with OUT tied to
TAP
3
O
SENSE) to output the fixed voltage corresponding to the part version (see Typical
Applications).
The exposed thermal pad on the bottom of the WSON package should be connected
to a copper thermal pad on the PCB under the package. The use of thermal vias to
remove heat from the package into the PCB is recommended. Connect the thermal
DAP (Thermal Pad -
√
—
pad to ground potential or leave floating. Do not connect the thermal pad to any
WSON only)
potential other than the same ground potential seen at device pin 1. For additional
information on using TI's non-pullback WSON package, see Application Note AN-
1187 Leadless Leadframe Package (LLP) (SNOA401).
Copyright © 1999–2015, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Links: LP2986



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