| поискавой системы для электроныых деталей |
|
LMF100CIWM датащи(PDF) 4 Page - Texas Instruments |
|
|
|||||||||||||||||||||||||||||
LMF100CIWM датащи(HTML) 4 Page - Texas Instruments |
|
4 / 42 page ![]() Not Recommended for New Designs LMF100 SNOSBG9B – JULY 1999 – REVISED JUNE 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply Voltage (V+ – V–) 16 V V+ + 0.3 Voltage at any pin V V– – 0.3 Input current at any pin(2) 5 mA Package input current(2) 20 mA Power dissipation(3) 500 mW N Package: 10 sec. 250 Soldering information(4) Vapor Phase (60 sec) 215 °C SOIC Package Infrared (15 sec) 220 Storage temperature, Tstg 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) When the input voltage (VIN) at any pin exceeds the power supply rails (VIN < V – or the absolute value of current at that pin should be limited to 5 mA or less. The sum of the currents at all pins that are driven beyond the power supply voltages should not exceed 20 mA.VIN +) (3) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, RθJA, and the ambient temperature, TA. The maximum allowable power dissipation at any temperature is PD = (TJMAX − TA)/RθJA or the number given in the Absolute Maximum Ratings, whichever is lower. For this device, TJMAX = 125°C, and the typical junction-to-ambient thermal resistance of the LMF100CIN when board mounted is 55°C/W. For the LMF100CIWM this number is 66°C/W. (4) See AN-450Surface Mounting Methods and Their Effect on Product Reliability(Appendix D) for other methods of soldering surface mount devices. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2) ±2000 V (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) A military RETS specification is available upon request. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT LMF100CCN 0 70 Temperature °C LMF100CIWM –40 85 Supply voltage 4 ≤V+ – V– ≤ 15 V 4 Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated Product Folder Links: LMF100 |
|
ссылки URL |
| Вашему бизинису помогли Аллдатащит? [ DONATE ] |
Что такое Аллдатащит | реклама | контакт | Конфиденциальность | Ссылка на техническое описание | обмен ссыками | поиск по производителю All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |