LM7372IMAXSLASHNOPB datasheet(4/28 Pages) TI1

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LM7372

SNOS926F – MAY 1999 – REVISED SEPTEMBER 2014

www.ti.com

6 Specifications

6.1 Absolute Maximum Ratings

(1) (2) (3)

over operating free-air temperature range (unless otherwise noted)

PARAMETER

MIN

MAX

UNIT

Suppy Voltage (V+

−V−)

Differential Input Voltage (VS = ±15V)

±10

Output Short Circuit to Ground(2)

Continuous

Infrared or Convection Reflow (20 sec.)

235

°C

Soldering Information

Wave Soldering Lead Temperature (10 sec.)

260

°C

Input Voltage

V− to V+

Maximum Junction Temperature(4)

150

°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics.

(2)

Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in

exceeding the maximum allowed junction temperature of 150°C.

(3)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(4)

The maximum power dissipation is a function of T(JMAX), RθJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (T(JMAX) – TA)/RθJA. All numbers apply for packages soldered directly into a PC board. The value for RθJA is

106°C/W for the 16-Pin SOIC package. With a total area of 4sq. in of 1oz CU connected to pins 1,6,8,9 & 16, RθJA for the 16-Pin SOIC

is decreased to 70°C/W. 8-Pin SO PowerPAD package RθJA is with 2 in

2 heatsink (top and bottom layer each) and 1 oz. copper (see

Table 2 and Application and Implementation )

6.2 Handling Ratings

MIN

MAX

UNIT

Tstg

Storage temperature range

−65

150

°C

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all

1500

pins(2)

V(ESD)

Electrostatic discharge(1)

Charged device model (CDM), per JEDEC specification

200

JESD22-C101, all pins(3)

(1)

For testing purposes, ESD was applied using human body model, 1.5k

Ω in series with 100pF. Machine model, 0Ω in series with 200pF.

(2)

JEDEC document JEP155 states that 1500-V HBM allows safe manufacturing with a standard ESD control process.

(3)

JEDEC document JEP157 states that 200-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

(1)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply Voltage

Operating Temperature Range

−40

°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics.

6.4 Thermal Information

DDA

THERMAL METRIC(1)

UNIT

8 PINS(2)

16 PINS(2)

RθJA

Junction-to-ambient thermal resistance

106

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

The maximum power dissipation is a function of T(JMAX), RθJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (T(JMAX) – TA)/RθJA. All numbers apply for packages soldered directly into a PC board. The value for RθJA is

106°C/W for the 16-Pin SOIC package. With a total area of 4sq. in of 1oz CU connected to pins 1,6,8,9 & 16, RθJA for the 16-Pin SOIC

is decreased to 70°C/W. 8-Pin SO PowerPAD package RθJA is with 2 in

2 heatsink (top and bottom layer each) and 1 oz. copper (see

Table 2 and Application and Implementation )

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