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LM7372IMAX/NOPB датащи(PDF) 3 Page - Texas Instruments

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номер детали LM7372IMAX/NOPB
подробное описание детали  LM7372 High Speed, High Output Current, Dual Operational Amplifier
PDF  28 Pages
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производитель  TI1 [Texas Instruments]
домашняя страница  http://www.ti.com
Logo TI1 - Texas Instruments

LM7372IMAX/NOPB датащи(HTML) 3 Page - Texas Instruments

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OUT B
1
2
3
4
5
6
7
8
OUT A
-IN A
+IN A
V
-
V
+
-IN B
+IN B
-
+
+
-
A
B
OUT A
1
2
8
+IN A
V-
V+
-IN B
+IN B
+
-
+
-
A
B
7
6
5
4
3
16
15
14
13
12
11
10
9
NC
NC
NC
NC
*
*
*
*
-IN A
OUT B
LM7372
www.ti.com
SNOS926F – MAY 1999 – REVISED SEPTEMBER 2014
5 Pin Configuration and Functions
NOTE
For SO PowerPAD package the exposed pad should be tied either to V− or left electrically
floating. Die attach material is conductive and is internally tied to V−.
* Heatsink Pins.(1)
Package DDA
Package D
8-Pin SO PowerPAD
16-Pin SOIC
Top View
Top View
Pin Functions
PIN
NUMBER
I/O
DESCRIPTION
NAME
DDA
D
*
––
1,8,9,16
––
Heatsink Pin
-IN A
2
4
I
ChA Inverting Input
+IN A
3
5
I
ChA Non-inverting Input
-IN B
6
12
I
ChB Inverting Input
+IN B
5
11
I
ChB Non-inverting Input
NC
––
2, 7, 10, 15
––
No Connection
OUT A
1
3
O
Output A
OUT B
7
13
O
Output B
V-
4
6
I
Negative Supply
V+
8
14
I
Positive Supply
(1)
The maximum power dissipation is a function of T(JMAX), RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (T(JMAX) – TA)/RθJA. All numbers apply for packages soldered directly into a PC board. The value for RθJA is
106°C/W for the 16-Pin SOIC package. With a total area of 4sq. in of 1oz CU connected to pins 1,6,8,9 & 16, RθJA for the 16-Pin SOIC
is decreased to 70°C/W. 8-Pin SO PowerPAD package RθJA is with 2 in
2 heatsink (top and bottom layer each) and 1 oz. copper (see
Table 2 and Application and Implementation )
Copyright © 1999–2014, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Links: LM7372



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