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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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LM4849 датащи(PDF) 12 Page - National Semiconductor (TI) |
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LM4849 датащи(HTML) 12 Page - National Semiconductor (TI) |
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12 / 19 page  Typical Performance Characteristics (Continued) Crosstalk Output Power vs Supply voltage 20076749 20076754 Output Power vs Supply Voltage Supply Current vs Supply Voltage 20076756 20076709 LM4849MH Power Dissipation vs Output Power LM4849MH Power Derating Curve 20076765 20076764 Note 17: These curves show the thermal dissipation ability of the LM4849MH at different ambient temperatures given these conditions: 500LFPM + 2in2: The part is soldered to a 2in2, 1 oz. copper plane with 500 linear feet per minute of forced-air flow across it. 2in2on bottom: The part is soldered to a 2in2, 1oz. copper plane that is on the bottom side of the PC board through 21 8 mil vias. 2in2: The part is soldered to a 2in2, 1oz. copper plane. 1in2: The part is soldered to a 1in2, 1oz. copper plane. Not Attached: The part is not soldered down and is not forced-air cooled. www.national.com 12 |
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