LM3549 datasheet(3/25 Pages) TI1

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LM3549

www.ti.com

SNVS640A – AUGUST 2010 – REVISED MAY 2013

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2) (3)

VDD and VOUT pins

−0.3V to 6.0V

Voltage on all other pins

−0.3V (VIN+0.3V)

w/6.0V max

Continuous Power Dissipation (4)

Internally Limited

Junction Temperature (TJ-MAX)

+150°C

Storage Temperature Range

-65°C to +150°C

Maximum Lead Temperature (Soldering)

(5)

ESD Rating (6)

Human Body Model

2.0kV

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is specified. Operating Ratings do not imply performance limits. For performance limits and associated test

conditions, see the Electrical Characteristics tables.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.

(4)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=+150°C (typ.) and

disengages at TJ=+140°C (typ.).

(5)

For detailed soldering specifications and information, please refer to Application Note AN-1187: Leadless Leadframe Package

(LLP).(SNOA401)

(6)

The Human body model is a 100 pF capacitor discharged through a 1.5 k

Ω resistor into each pin. (MIL-STD-883 3015.7)

Operating Ratings

(1) (2)

Input Voltage Range

2.7V to 5.5V

Junction Temperature (TJ) Range

−30°C to +125°C

Ambient Temperature (TA) Range

(3)

−30°C to +85°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is specified. Operating Ratings do not imply performance limits. For performance limits and associated test

conditions, see the Electrical Characteristics tables.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

In applications where high-power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =

+125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the

part/package in the application (

θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX).

Thermal Properties

Junction-to-Ambient Thermal Resistance (

θJA), WQFN-24 Package

(1)

35 - 50°C/W

(1)

Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power

dissipation exists, special care must be paid to thermal dissipation issues in board design.

Electrical Characteristics

(1) (2)

Limits in standard type face are for TA = 25°C. Limits in boldface type apply over the full operating ambient temperature

range (

−30°C ≤ TA ≤ +85°C). Unless otherwise noted, specifications apply to Figure 1 with: VIN = 3.6V, CIN = 10 µF, COUT =

4.7µF and L1 = 2.2 µH.

(3)

Parameter

Test Conditions

Min

Typ

Max

Units

VIN

Supply voltage

Minimum voltage for startup

2.7

Full output power

3.1

5.5

IIN

Shutdown supply current

EN low

µA

(IVDDP + IVDDS)

Standby supply current

EN High, x_EN low

0.4

IIN

Active mode supply current

EN High, x_EN high, RGB outputs

1.6

(IVDDS)

open

(1)

All voltages are with respect to the potential at the GND pin.

(2)

Min and Max limits are specified by design, test, or statistical analysis. Typical (Typ) numbers represent the most likely norm.

(3)

CIN, COUT: Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics.

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