ADS8364YSLASH2K datasheet(2/22 Pages) TI

2 / 22 page

ADS8364

SBAS219B

www.ti.com

MAXIMUM

INTEGRAL

NO MISSING

SPECIFIED

LINEARITY

CODES

PACKAGE

TEMPERATURE

ORDERING

TRANSPORT

PRODUCT

ERROR (LSB)

PACKAGE-LEAD

DESIGNATOR(1)

RANGE

NUMBER

MEDIA, QUANTITY

ADS8364Y

±8

TQFP-64

PAG

–40

°C to +85°C

ADS8364Y/250

Tape and Reel, 250

ADS8364Y/2K

Tape and Reel, 2000

NOTES: (1) For the most current specifications and package information, refer to our website at www.ti.com.

PACKAGE/ORDERING INFORMATION

ABSOLUTE MAXIMUM RATINGS

Absolute Maximum Ratings over operating free-air temperature (unless

otherwise noted)(1)

Supply Voltage, AGND to AVDD ............................................................... –0.3V to 6V

Supply Voltage, BGND to BVDD ............................................................... –0.3V to 6V

Supply Voltage, DGND to DVDD .............................................................. –0.3V to 6V

Analog Input Voltage Range ..................... AGND – 0.3V to AVDD + 0.3V

Reference Input Voltage ........................... AGND – 0.3V to AVDD + 0.3V

Digital Input Voltage Range ...................... BGND – 0.3V to BVDD + 0.3V

Ground Voltage Differences, AGND to BGND/DGND .....................

±0.3V

Voltage Differences, BVDD, DVDD to AGND .......................... –0.3V to 6V

Input Current ot Any Pin Except Supply ......................... –20mA to 20mA

Power Dissipation ....................................... See Dissipation Rating Table

Operating Virtual Junction Temperature Range, TJ ........ –40°C to 150°C

Operating Free-Air Temperature Range, TA ...................... –40°C to 85°C

Storage Temperature Range, TSTG .................................. –65°C to 150°C

Lead Temperature 1.6mm (1/16 inch) from Case for 10sec ..................... 260

°C

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Texas Instru-

ments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling

and installation procedures can cause damage.

ESD damage can range from subtle performance degradation

to complete device failure. Precision integrated circuits may be

more susceptible to damage because very small parametric

changes could cause the device not to meet its published

specifications.

NOTE: (1) Stresses beyond those listed under "absolute maximum ratings" may

cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those

indicated under "recommended operating conditions" is not implied. Exposure

to absolute-maximum-rated conditions of extended periods may affect device

reliability.

RECOMMENDED OPERATING CONDITIONS

MIN

NOM

MAX

UNIT

Supply Voltage, AGND to AVDD

4.75

5.25

Supply Voltage, BGND to BVDD

Low-Voltage Levels

2.7

3.6

5V Logic Levels

4.5

5.5

Supply Voltage, DGND to DVDD

4.75

5.25

Difference AVDD to DVDD

–0.3

0.3

Reference Input Voltage

1.5

2.5

2.6

Operating Common-Mode Signal

–IN

2.2

2.5

2.8

Analog Inputs

+IN – (–IN)

±V

REF

Operating Junction Temperature Range, TJ

–40

125

°C

DERATING

FACTOR

TA ≤ 25°CTA = 70°CTA = 85°C

ABOVE

POWER

BOARD

PACKAGE

RθJC

RθJA

TA = 25°C

RATING

Low-K(1)

DGK

8.6

°C/W

68.5

°C/W

14.598mW/

°C

1824mW

1168mW

949mW

High-K(2)

DGK

8.6

°C/W

42.8

°C/W

23.364mw/

°C

2920mW

1869mW

1519mW

NOTES: (1) The JEDEC Low K (1s) board design used to derive this data was a 3-inch x 3-inch, two-layer board with 2-ounce copper traces on top of the board.

(2) The JEDEC High K (2s2p) board design used to derive this data was a 3-inch x 3-inch, multilayer board with 1-ounce internal power and ground planes and 2-ounce

copper traces on the top and bottom of the board.

PACKAGE DISSIPATION RATING TABLE

ON = 20Ω

(SAMPLE) = 20pF

BGND

AGND

Diode Turn-on Voltage: 0.35V

Equivalent Digital Input Circuit

Equivalent Analog Input Circuit

EQUIVALENT INPUT CIRCUIT

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