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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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AMC7836IPAP датащи(PDF) 71 Page - Texas Instruments |
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AMC7836IPAP датащи(HTML) 71 Page - Texas Instruments |
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71 / 88 page  MUX ADC GPIO Local Temperature Sensor DAC Heat Sink Temperature Sensor Power Power Power Amplifier Power Amplifier RF IN RF IN AMC7836 Current Sense Amplifier Heat Sink R(shunt) ¨9 Temperature Sensing Current Sensing 71 AMC7836 www.ti.com SLAS986C – NOVEMBER 2014 – REVISED APRIL 2016 Product Folder Links: AMC7836 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information The AMC7836 device is a highly integrated, low-power, analog monitoring and control solution that includes a 21-channel (12-bit) ADC, 16-channel (12-bit) DACs, eight GPIO, and a local temperature sensor. Although the device can be used in many different closed-loop systems, including industrial control and test and measurement, the device is largely used as a power amplifier controller in multi-channel RF communication applications. Power amplifiers (PAs) include transistor technologies that are extremely temperature sensitive, and require DC biasing circuits to optimize RF performance, power efficiency, and stability. The AMC7836 device provides 16 DAC channels which can be used to adjust the power amplifier bias points in response to temperature changes. The device also includes an internal local temperature sensor, and 21 ADC channels for general-purpose monitoring. Current and temperature sensing are typically implemented in power amplifier controller applications. PA drain current sensing is implemented by measuring the differential voltage drop across a shunt resistor. Temperature variations during PA operation can be detected either through the AMC7836 internal temperature sensor or through remote temperature ICs or thermistors configured to interface with the ADC analog inputs available in the device. Figure 114 shows the block diagram for these different systems. Figure 114. AMC7836 Example Control and Monitor System |
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