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DMP213DUFA датащи(PDF) 2 Page - Diodes Incorporated |
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DMP213DUFA датащи(HTML) 2 Page - Diodes Incorporated |
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2 / 6 page ![]() DMP213DUFA Document number: DS36466 Rev. 1 - 2 2 of 6 www.diodes.com July 2014 © Diodes Incorporated DMP213DUFA Maximum Ratings (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Unit Drain-Source Voltage VDSS -25 V Gate-Source Voltage VGSS -8 Continuous Drain Current VGS = 4.5V (Note 6) ID -166 mA TA = +70°C (Note 6) -125 (Note 5) ID -145 mA Pulsed Drain Current (Note 7) IDM -500 mA Thermal Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Unit Power Dissipation (Note 5) PD 360 mW Thermal Resistance, Junction to Ambient (Note 5) RθJA 353 °C/W Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C Electrical Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Min Typ Max Unit Test Condition OFF CHARACTERISTICS (Note 7) Drain-Source Breakdown Voltage BVDSS -25 — — V VGS = 0V, ID = -250μA Zero Gate Voltage Drain Current IDSS — — -1 µA VDS = -20V, VGS = 0V Gate-Source Leakage IGSS — — -100 nA VGS = -8V, VDS = 0V ON CHARACTERISTICS (Note 7) Gate Threshold Voltage VGS(th) -0.65 -0.9 -1.5 V VDS = VGS, ID = -250μA Static Drain-Source On-Resistance RDS(on) — — 10 Ω VGS = -4.5V, ID = -0.2A — — 13 VGS = -2.7V, ID = -0.05A Forward Transfer Admittance |Yfs| — 189 — S VDS = -5V, ID = -0.2A Diode Forward Voltage VSD — — -1.5 V VGS = 0V, IS = -0.2A DYNAMIC CHARACTERISTICS (Note 8) Input Capacitance Ciss — 27.2 — pF VDS = -10V, VGS = 0V, f = 1MHz Output Capacitance Coss — 6.1 — pF Reverse Transfer Capacitance Crss — 1.7 — pF Total Gate Charge Qg — 0.35 — nC VDS = -5V, ID = -0.2A, VGS = -4.5V Gate-Source Charge Qgs — 0.08 — nC Gate-Drain Charge Qgd — 0.06 — nC Turn-On Delay Time tD(on) — 4.5 — ns VDS = -6V, VGS = -4.5V, ID = -0.2A, RG = 50Ω Turn-On Rise Time tr — 2.3 — ns Turn-Off Delay Time tD(off) — 24.1 — ns Turn-Off Fall Time tf — 11 — ns Notes: 5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided. 6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper pad layout 7 .Short duration pulse test used to minimize self-heating effect. 8. Guaranteed by design. Not subject to production testing. |
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