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DMN3018SFG датащи(PDF) 2 Page - Diodes Incorporated |
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DMN3018SFG датащи(HTML) 2 Page - Diodes Incorporated |
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2 / 6 page ![]() DMN3018SFG Document number: DS35638 Rev. 4 - 2 2 of 6 www.diodes.com April 2014 © Diodes Incorporated DMN3018SFG Maximum Ratings (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Units Drain-Source Voltage VDSS 30 V Gate-Source Voltage VGSS ±25 V Continuous Drain Current (Note 6) VGS = 10V Steady State TA = +25°C TA = +70°C ID 8.5 6.8 A t<10s TA = +25°C TA = +70°C ID 11.3 9.1 A Continuous Drain Current (Note 6) VGS = 4.5V Steady State TA = +25°C TA = +70°C ID 6.6 5.3 A t<10s TA = +25°C TA = +70°C ID 8.7 7.0 A Maximum Continuous Body Diode Forward Current (Note 4) IS 2.5 A Pulsed Drain Current (10µs pulse, duty cycle = 1%) IDM 60 A Avalanche Current (Note 7) L = 0.1mH IAS 18 A Avalanche Energy (Note 7) L = 0.1mH EAS 16 mJ Thermal Characteristics Characteristic Symbol Value Units Total Power Dissipation (Note 5) PD 1.0 W Thermal Resistance, Junction to Ambient (Note 5) Steady State RθJA 126 °C/W t<10s 71 Total Power Dissipation (Note 6) PD 2.2 W Thermal Resistance, Junction to Ambient (Note 6) Steady State RθJA 56 °C/W t<10s 31 Thermal Resistance, Junction to Case RθJC 7.0 Operating and Storage Temperature Range TJ, TSTG -55 to 150 °C Electrical Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Min Typ Max Unit Test Condition OFF CHARACTERISTICS (Note 7) Drain-Source Breakdown Voltage BVDSS 30 — — V VGS = 0V, ID = 250μA Zero Gate Voltage Drain Current IDSS — — 1 μA VDS = 24V, VGS = 0V Gate-Source Leakage IGSS — — ±10 μA VGS = ±20V, VDS = 0V ON CHARACTERISTICS (Note 7) Gate Threshold Voltage VGS(th) 1 1.7 2.1 V VDS = VGS, ID = 250μA Static Drain-Source On-Resistance RDS(ON) — 16 21 mΩ VGS = 10V, ID = 10A — 21 35 VGS = 4.5V, ID = 8.5A Diode Forward Voltage VSD 0.5 — 1.2 V VGS = 0V, IS = 1A DYNAMIC CHARACTERISTICS (Note 8) Input Capacitance Ciss — 697 — pF VDS = 15V, VGS = 0V, f = 1.0MHz Output Capacitance Coss — 97 — pF Reverse Transfer Capacitance Crss — 67 — pF Gate resistance Rg — 1.47 — Ω VDS = 0V, VGS = 0V,f = 1.0MHz Total Gate Charge (VGS = 4.5V) Qg — 6.0 — nC VGS = 10V, VDS = 15V, ID = 9A Total Gate Charge (VGS = 10V) Qg — 13.2 — nC Gate-Source Charge Qgs — 2.2 — nC Gate-Drain Charge Qgd — 1.8 — nC Turn-On Delay Time tD(on) — 4.3 — ns VDD = 15V, VGS = 10V, RL = 15Ω,ID = 1A, RG = 6Ω Turn-On Rise Time tr — 4.4 — ns Turn-Off Delay Time tD(off) — 20.1 — ns Turn-Off Fall Time tf — 4.1 — ns Reverse Recovery Time Trr — 7.3 — ns IF = 9A, di/dt = 500A/µs Reverse Recovery Charge Qrr — 7.9 — nC Notes: 5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided. 6. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate 7. IAS and EAS rating are based on low frequency and duty cycles to keep TJ = +25°C 8. Short duration pulse test used to minimize self-heating effect. 9. Guaranteed by design. Not subject to product testing. |
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