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MICRF005 датащи(PDF) 6 Page - Micrel Semiconductor |
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MICRF005 датащи(HTML) 6 Page - Micrel Semiconductor |
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6 / 11 page ![]() MICRF005 Micrel MICRF005 6 October 2001 duty-cycled operation. The actual tolerable leakage will be application dependent. Clearly, leakage performance is less critical when the device off-time is low (milliseconds) and more critical when the off-time is high (seconds). To further enhance duty-cycled operation of the IC, the AGC push and pull currents are increased for a fixed time immedi- ately after the device is taken out of shutdown mode (turned- on). This compensates for AGC capacitor voltage droop while the IC is in shutdown mode, reduces the time to restore the correct AGC voltage, and therefore extends maximum achievable duty ratios. Push-pull currents are increased by 45 times their nominal values. The fixed time period is based on the reference oscillator frequency f T, [tbd]ms for fT = 14.3359MHz, and varies inversely as f T varies. Transmit / Standby Function The transmit/receive function is controlled by the logic state of T/R. T/R is internally tied to V SS. When T/R is open circuit or in the low state, the MICRF005 functions in its normal receive operating mode. The T/R pin may be pulled high to Vdd, this will place the receiver in a “stand-by” operating mode. This mode is intended for use during transmit cycles in transceiver applications where the receiver is co-located with a transmitter. In this “transmit” mode, the receiver oscillator remains active but the AGC function is disabled and the CAGC pin is high impedance to hold the AGC capacitor voltage. This function enables the MICRF005 to immediately resume receive operation after a transmit cycle. Shutdown Function The shutdown function is controlled by a logic state applied to the SHUT pin. When V SHUT is high, the device goes into low-power standby mode, consuming less than 1 µA. This pin is pulled high internally. It must be externally pulled low to enable the receiver. Reference Oscillator All timing and tuning operations on the MICRF005 are de- rived from the internal Colpitts reference oscillator. Timing and tuning is controlled through the REFOSC pin in one of two ways: 1. Connect a crystal 2. Drive this pin with an external timing signal The second approach is attractive for lowering system cost further if an accurate reference signal exists elsewhere in the system, for example, a reference clock from a crystal-con- trolled microprocessor. An externally applied signal should be ac-coupled and resistively-attenuated, or otherwise lim- ited, to approximately 0.5Vpp. The specific reference fre- quency required is related to the system transmit frequency. I/O Pin Interface Circuitry Interface circuitry for the various I/O pins of the MICRF005 are diagrammed in Figures 1 through 6. The ESD protection diodes at all input and output pins are not shown. Integrated into an actual design application with the best results pos- sible. CTH Pin 6.9pF PHI2B PHI1B PHI1 PHI2 CTH Demodulator Signal 2.85Vdc VDDBB VSSBB VSSBB Figure 2. C TH Pin Figure 2 illustrates the CTH-pin interface circuit. The CTH pin is driven from a P-channel MOSFET source-follower with approximately 10 µA of bias. Transmission gates TG1 and TG2 isolate the 6.9pF capacitor. Internal control signals PHI1/PHI2 are related in a manner such that the impedance across the transmission gates looks like a “resistance” of approximately 100k Ω. The dc potential at the CTH pin is approximately 1.6V CAGC Pin VDDBB VSSBB 675µA 67.5µA Compa- rator 1.5µA 15µA Timout CAGC Figure 3. C AGC Pin Figure 3 illustrates the CAGC pin interface circuit. The AGC control voltage is developed as an integrated current into a capacitor C AGC. The attack current is nominally 15µA, while the decay current is a 1/10th scaling of this, nominally 1.5 µA, making the attack/decay timeconstant ratio a fixed 10:1. Signal gain of the RF/IF strip inside the IC diminishes as the voltage at CAGC decreases. Modification of the attack/decay ratio is possible by adding resistance from the CAGC pin to either V DDBB or VSSBB, as desired. Both the push and pull current sources are disabled during shutdown, which maintains the voltage across C AGC, and improves recovery time in duty-cycled applications. To fur- ther improve duty-cycle recovery, both push and pull currents are increased by 45 times for approximately 10ms after release of the SHUT pin. This allows rapid recovery of any voltage droop on C AGC while in shutdown. |
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