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MICRF005 датащи(PDF) 6 Page - Micrel Semiconductor

номер детали MICRF005
подробное описание детали  115kbps, 800MHz - 1GHz UHF Receiver
PDF  11 Pages
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производитель  MICREL [Micrel Semiconductor]
домашняя страница  http://www.micrel.com
Logo MICREL - Micrel Semiconductor

MICRF005 датащи(HTML) 6 Page - Micrel Semiconductor

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MICRF005
Micrel
MICRF005
6
October 2001
duty-cycled operation. The actual tolerable leakage will be
application dependent. Clearly, leakage performance is less
critical when the device off-time is low (milliseconds) and
more critical when the off-time is high (seconds).
To further enhance duty-cycled operation of the IC, the AGC
push and pull currents are increased for a fixed time immedi-
ately after the device is taken out of shutdown mode (turned-
on). This compensates for AGC capacitor voltage droop
while the IC is in shutdown mode, reduces the time to restore
the correct AGC voltage, and therefore extends maximum
achievable duty ratios. Push-pull currents are increased by
45 times their nominal values. The fixed time period is based
on the reference oscillator frequency f
T, [tbd]ms for fT =
14.3359MHz, and varies inversely as f
T varies.
Transmit / Standby Function
The transmit/receive function is controlled by the logic state
of T/R. T/R is internally tied to V
SS. When T/R is open circuit
or in the low state, the MICRF005 functions in its normal
receive operating mode. The T/R pin may be pulled high to
Vdd, this will place the receiver in a “stand-by” operating
mode. This mode is intended for use during transmit cycles
in transceiver applications where the receiver is co-located
with a transmitter. In this “transmit” mode, the receiver
oscillator remains active but the AGC function is disabled and
the CAGC pin is high impedance to hold the AGC capacitor
voltage. This function enables the MICRF005 to immediately
resume receive operation after a transmit cycle.
Shutdown Function
The shutdown function is controlled by a logic state applied
to the SHUT pin. When V
SHUT is high, the device goes into
low-power standby mode, consuming less than 1
µA. This pin
is pulled high internally. It must be externally pulled low to
enable the receiver.
Reference Oscillator
All timing and tuning operations on the MICRF005 are de-
rived from the internal Colpitts reference oscillator. Timing
and tuning is controlled through the REFOSC pin in one of two
ways:
1. Connect a crystal
2. Drive this pin with an external timing signal
The second approach is attractive for lowering system cost
further if an accurate reference signal exists elsewhere in the
system, for example, a reference clock from a crystal-con-
trolled microprocessor. An externally applied signal should
be ac-coupled and resistively-attenuated, or otherwise lim-
ited, to approximately 0.5Vpp. The specific reference fre-
quency required is related to the system transmit frequency.
I/O Pin Interface Circuitry
Interface circuitry for the various I/O pins of the MICRF005
are diagrammed in Figures 1 through 6. The ESD protection
diodes at all input and output pins are not shown. Integrated
into an actual design application with the best results pos-
sible.
CTH Pin
6.9pF
PHI2B
PHI1B
PHI1
PHI2
CTH
Demodulator
Signal
2.85Vdc
VDDBB
VSSBB
VSSBB
Figure 2. C
TH Pin
Figure 2 illustrates the CTH-pin interface circuit. The CTH pin
is driven from a P-channel MOSFET source-follower with
approximately 10
µA of bias. Transmission gates TG1 and
TG2 isolate the 6.9pF capacitor. Internal control signals
PHI1/PHI2 are related in a manner such that the impedance
across the transmission gates looks like a “resistance” of
approximately 100k
Ω. The dc potential at the CTH pin is
approximately 1.6V
CAGC Pin
VDDBB
VSSBB
675µA
67.5µA
Compa-
rator
1.5µA
15µA
Timout
CAGC
Figure 3. C
AGC Pin
Figure 3 illustrates the CAGC pin interface circuit. The AGC
control voltage is developed as an integrated current into a
capacitor C
AGC. The attack current is nominally 15µA, while
the decay current is a 1/10th scaling of this, nominally 1.5
µA,
making the attack/decay timeconstant ratio a fixed 10:1.
Signal gain of the RF/IF strip inside the IC diminishes as the
voltage at CAGC decreases. Modification of the attack/decay
ratio is possible by adding resistance from the CAGC pin to
either V
DDBB or VSSBB, as desired.
Both the push and pull current sources are disabled during
shutdown, which maintains the voltage across C
AGC, and
improves recovery time in duty-cycled applications. To fur-
ther improve duty-cycle recovery, both push and pull currents
are increased by 45 times for approximately 10ms after
release of the SHUT pin. This allows rapid recovery of any
voltage droop on C
AGC while in shutdown.



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