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MB9B520M датащи(PDF) 102 Page - SPANSION |
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MB9B520M датащи(HTML) 102 Page - SPANSION |
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102 / 113 page ![]() DataS h eet March 10, 2015, MB9B520M_DS706-00048-3v0-E 99 CONFIDENTIAL Package Dimensions 80-pin plastic LQFP Lead pitch 0.50 mm Package width × package length 12.00 mm × 12.00 mm Lead shape Gullwing Lead bend direction Normal bend Sealing method Plastic mold Mounting height 1.70 mm MAX Weight 0.47 g 80-pin plastic LQFP (FPT-80P-M37) (FPT-80P-M37) 2009-2010 FUJITSU SEMICONDUCTOR LIMITED F80037S-c-1-2 120 40 21 60 41 80 61 INDEX *12.00± 0.10(.472 ± .004)SQ 14.00± 0.20(.551 ± .008)SQ 0.50(.020) 0.22± 0.05 (.009± .002) M 0.08(.003) 0.145± 0.055 (.006± .002) 0.08(.003) "A" (Stand off) Details of "A" part (.004 ± .002) 0.10 ± 0.05 (.024 ± .006) 0.60 ± 0.15 (.020 ± .008) 0.25(.010) 0.50 ± 0.20 (Mounting height) .059–.004 +.008 –0.10 +0.20 1.50 0~8° C Dimensions in mm (inches). Note: The values in parentheses are reference values. Note 1) * : These dimensions do not include resin protrusion. Note 2) Pins width and pins thickness include plating thickness. Note 3) Pins width do not include tie bar cutting remainder. |
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