MB9AAA0N datasheet(49/109 Pages) SPANSION

49 / 109 page

D a t a S h e e t

MB9AAA0N_DS706-00067-2v0-E, June 30, 2015

CONFIDENTIAL

 C Pin

This series contains the regulator. Be sure to connect a smoothing capacitor (CS) for the regulator

between the C pin and the GND pin. Please use a ceramic capacitor or a capacitor of equivalent

frequency characteristics as a smoothing capacitor.

However, some laminated ceramic capacitors have the characteristics of capacitance variation due to

thermal fluctuation (F characteristics and Y5V characteristics). Please select the capacitor that meets the

specifications in the operating conditions to use by evaluating the temperature characteristics of a

capacitor.

A smoothing capacitor of about 4.7μF would be recommended for this series.

 Mode pins (MD0, MD1)

Connect the MD pin (MD0, MD1) directly to VCC or VSS pins. Design the printed circuit board such that

the pull-up/down resistance stays low, as well as the distance between the mode pins and VCC pins or VSS

pins is as short as possible and the connection impedance is low, when the pins are pulled-up/down such as

for switching the pin level and rewriting the Flash memory data. It is because of preventing the device

erroneously switching to test mode due to noise.

 Notes on power-on

Turn power on/off in the following order or at the same time.

If not using the A/D converter, connect AVCC = VCC and AVSS = VSS.

Turning on: VCC  AVCC  AVRH

Turning off: AVRH  AVCC  VCC

 Serial Communication

There is a possibility to receive wrong data due to the noise or other causes on the serial communication.

Therefore, design a printed circuit board so as to avoid noise.

Consider the case of receiving wrong data due to noise, perform error detection such as by applying a

checksum of data at the end. If an error is detected, retransmit the data.

 Differences in features among the products with different memory sizes and between

Flash memory products and MASK products

The electric characteristics including power consumption, ESD, latch-up, noise characteristics, and

oscillation characteristics among the products with different memory sizes and between Flash memory

products and MASK products are different because chip layout and memory structures are different.

If you are switching to use a different product of the same series, please make sure to evaluate the electric

characteristics.

Device

VSS

GND

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