LP38853_15 datasheet(4/30 Pages) TI1

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LP38853

SNVS335E – DECEMBER 2006 – REVISED NOVEMBER 2015

www.ti.com

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

VIN supply voltage (survival)

−0.3

VBIAS supply voltage (survival)

−0.3

VSS soft-start voltage (survival)

−0.3

VOUT voltage (survival)

−0.3

IOUT current (survival)

Internally Limited

Junction temperature

−40

150

°C

Power dissipation(3)

Internally Limited

Storage temperature, Tstg

−65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, contact the TI Sales Office/ Distributors for availability and specifications.

(3)

Device power dissipation must be de-rated based on device power dissipation (PD), ambient temperature (TA), and package junction-to-

ambient thermal resistance (RθJA). Additional heat sinking may be required to ensure that the device junction temperature (TJ) does not

exceed the maximum operating rating. See the Application and Implementation section for details.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

(VOUT + VDO)

VIN supply voltage (survival)

to VBIAS

0.8 V

≤ VOUT ≤ 1.2 V

5.5

VBIAS supply voltage (survival)

(2)

1.2 V < VOUT ≤ 1.8 V

4.5

5.5

VEN voltage

VBIAS

IOUT

Junction temperature(3)

−40

125

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability

(2)

VIN cannot exceed either VBIAS or 4.5 V, whichever value is lower.

(3)

Device power dissipation must be de-rated based on device power dissipation (PD), ambient temperature (TA), and package junction to

ambient thermal resistance (RθJA). Additional heat-sinking may be required to ensure that the device junction temperature (TJ) does not

exceed the maximum operating rating. See the Application and Implementation section for details.

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