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VL6180X датащи(PDF) 11 Page - STMicroelectronics |
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VL6180X датащи(HTML) 11 Page - STMicroelectronics |
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11 / 79 page ![]() DocID026171 Rev 6 11/79 VL6180X Overview 78 1.5 Recommended solder pad dimensions Figure 4. Recommended solder pattern 1.6 Recommended reflow profile The recommend reflow profile is shown in Figure 5 and Table 3. Figure 5. Recommended reflow profile Note: As the VL6180X package is not sealed, only a dry re-flow process should be used (such as convection re-flow). Vapor phase re-flow is not suitable for this type of optical component. The VL6180X is an optical component and as such, it should be treated carefully. This would typically include using a ‘no-wash’ assembly process. 0.55 mm 0.60 mm Pad pitch 0.75 mm 1.40 mm Same as device pad dimensions Table 3. Recommended reflow profile Profile Ramp to strike Temperature gradient in preheat (T= 70 - 180 °C): 0.9 +/- 0.1 °C/s Temperature gradient (T= 200 - 225 °C): 1.1 - 3.0 °C/s Peak temperature in reflow 237 °C - 245°C Time above 220 °C 50 +/- 10 seconds Temperature gradient in cooling -1 to -4 °C/s (-6°C/s maximum) Time from 50 to 220 °C 160 to 220 seconds |
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