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STM32F756VG датащи(PDF) 227 Page - STMicroelectronics |
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STM32F756VG датащи(HTML) 227 Page - STMicroelectronics |
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227 / 228 page ![]() DocID027589 Rev 4 227/228 STM32F756xx Revision history 227 10-Dec-2015 3 Updated Table 10: STM32F756xx pin and ball definition additional function column: WKUP1, 2, 3, 4, 5, 6 must be respectively PA0, PA2, PC1, PC13, PI8, PI11. Updated Table 62: ADC characteristics adding VREF- negative voltage reference. Update Table 14: Voltage characteristics adding table note 3. Updated Table 69: Temperature sensor calibration values memory addresses. Updated Table 72: Internal reference voltage calibration values memory addresses. 16-Feb-2016 4 Updated Table 52: EMI characteristics modifying 25/180 MHz by 25/200 MHz. Updated Figure 13: STM32F756Zx WLCSP143 ballout. Added TFBGA100 8 x 8 mm package: – Updated Cover page. – Updated Section 1: Description. – Updated Table 2: STM32F756xx features and peripheral counts. – Updated Table 4: Regulator ON/OFF and internal reset ON/OFF availability. – Updated Section 3: Pinouts and pin description adding Figure 12: STM32F756Vx TFBGA100 ballout and adding TFBGA100 ball description in Table 10: STM32F756xx pin and ball definition. – Updated Table 17: General operating conditions. – Updated Table 53: ESD absolute maximum ratings. – Updated notes below Figure 43 and Figure 44. – Updated Section 6: Package information adding Section 6.2: TFBGA100, 8 x 8 x 0.8 mm thin fine-pitch ball grid array package information and adding thermal resistance in Table 124: Package thermal characteristics. – Updated Table 10: STM32F756xx pin and ball definition note 5. Updated Table 35: Peripheral current consumption peripheral consumption on APB1 and APB2. Updated Figure 18: STM32F756Nx TFBGA216 ballout. Table 127. Document revision history (continued) Date Revision Changes |
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