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STM32F756VG датащи(PDF) 227 Page - STMicroelectronics

номер детали STM32F756VG
подробное описание детали  Up to 25 communication interfaces
PDF  228 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
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STM32F756VG датащи(HTML) 227 Page - STMicroelectronics

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DocID027589 Rev 4
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STM32F756xx
Revision history
227
10-Dec-2015
3
Updated Table 10: STM32F756xx pin and ball definition additional
function column: WKUP1, 2, 3, 4, 5, 6 must be respectively PA0, PA2,
PC1, PC13, PI8, PI11.
Updated Table 62: ADC characteristics adding VREF- negative voltage
reference.
Update Table 14: Voltage characteristics adding table note 3.
Updated Table 69: Temperature sensor calibration values memory
addresses.
Updated Table 72: Internal reference voltage calibration values
memory addresses.
16-Feb-2016
4
Updated Table 52: EMI characteristics modifying 25/180 MHz by
25/200 MHz.
Updated Figure 13: STM32F756Zx WLCSP143 ballout.
Added TFBGA100 8 x 8 mm package:
– Updated Cover page.
– Updated Section 1: Description.
– Updated Table 2: STM32F756xx features and peripheral counts.
– Updated Table 4: Regulator ON/OFF and internal reset ON/OFF
availability.
– Updated Section 3: Pinouts and pin description adding Figure 12:
STM32F756Vx TFBGA100 ballout and adding TFBGA100 ball
description in Table 10: STM32F756xx pin and ball definition.
– Updated Table 17: General operating conditions.
– Updated Table 53: ESD absolute maximum ratings.
– Updated notes below Figure 43 and Figure 44.
– Updated Section 6: Package information adding Section 6.2:
TFBGA100, 8 x 8 x 0.8 mm thin fine-pitch ball grid array package
information and adding thermal resistance in Table 124: Package
thermal characteristics.
– Updated Table 10: STM32F756xx pin and ball definition note 5.
Updated Table 35: Peripheral current consumption peripheral
consumption on APB1 and APB2.
Updated Figure 18: STM32F756Nx TFBGA216 ballout.
Table 127. Document revision history (continued)
Date
Revision
Changes



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