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STM32F756VG датащи(PDF) 225 Page - STMicroelectronics

номер детали STM32F756VG
подробное описание детали  Up to 25 communication interfaces
PDF  228 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
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STM32F756VG датащи(HTML) 225 Page - STMicroelectronics

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225/228
STM32F756xx
Recommendations when using internal reset OFF
227
Appendix A
Recommendations when using internal reset
OFF
When the internal reset is OFF, the following integrated features are no longer supported:
The integrated power-on reset (POR) / power-down reset (PDR) circuitry is disabled.
The brownout reset (BOR) circuitry must be disabled.
The embedded programmable voltage detector (PVD) is disabled.
VBAT functionality is no more available and VBAT pin should be connected to VDD.
The over-drive mode is not supported.
A.1
Operating conditions
Table 126. Limitations depending on the operating power supply range
Operating
power
supply
range
ADC
operation
Maximum
Flash
memory
access
frequency
with no wait
states
(fFlashmax)
Maximum Flash
memory access
frequency with
wait states (1)(2)
1. Applicable only when the code is executed from Flash memory. When the code is executed from RAM, no
wait state is required.
2. Thanks to the ART accelerator on ITCM interface and L1-cache on AXI interface, the number of wait states
given here does not impact the execution speed from the Flash memory since the ART accelerator or L1-
cache allows to achieve a performance equivalent to 0-wait state program execution.
I/O operation
Possible Flash
memory
operations
VDD =1.7 to
2.1 V(3)
3. VDD/VDDA minimum value of 1.7 V, with the use of an external power supply supervisor (refer to
Section 2.17.1: Internal reset ON).
Conversion
time up to
1.2 Msps
20 MHz
180 MHz with 8
wait states and
over-drive OFF
– No I/O
compensation
8-bit erase and
program
operations only



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