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STM32F756VG датащи(PDF) 222 Page - STMicroelectronics |
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STM32F756VG датащи(HTML) 222 Page - STMicroelectronics |
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222 / 228 page ![]() Package information STM32F756xx 222/228 DocID027589 Rev 4 Marking of engineering samples The following figure gives an example of topside marking orientation versus ball A1 identifier location. Figure 102. TFBGA216, 13 × 13 × 0.8 mm thin fine-pitch ball grid array package top view example 1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not yet ready to be used in production and any consequences deriving from such usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering samples in production. ST Quality has to be contacted prior to any decision to use these Engineering samples to run qualification activity. |
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