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M24C02-DRMF3TP датащи(PDF) 32 Page - STMicroelectronics |
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M24C02-DRMF3TP датащи(HTML) 32 Page - STMicroelectronics |
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32 / 39 page ![]() Package mechanical data M24C02-A125 32/39 DocID025755 Rev 4 9 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 13. TSSOP8 – 8-lead thin shrink small outline, package outline 1. Drawing is not to scale. Table 13. TSSOP8 – 8-lead thin shrink small outline, package mechanical data Symbol millimeters inches(1) 1. Values in inches are converted from mm and rounded to four decimal digits. Typ. Min. Max. Typ. Min. Max. A - - 1.200 - - 0.0472 A1 - 0.050 0.150 - 0.0020 0.0059 A2 1.000 0.800 1.050 0.0394 0.0315 0.0413 b - 0.190 0.300 - 0.0075 0.0118 c - 0.090 0.200 - 0.0035 0.0079 CP - - 0.100 - - 0.0039 D 3.000 2.900 3.100 0.1181 0.1142 0.1220 e 0.650 - - 0.0256 - - E 6.400 6.200 6.600 0.2520 0.2441 0.2598 E1 4.400 4.300 4.500 0.1732 0.1693 0.1772 L 0.600 0.450 0.750 0.0236 0.0177 0.0295 L1 1.000 - - 0.0394 - - α - 0° 8° - 0° 8° |
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