ADS5294IPFPR datasheet(9/81 Pages) TI1

9 / 81 page

ADS5294

www.ti.com

SLAS776D – NOVEMBER 2011 – REVISED SEPTEMBER 2015

8.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

SUPPLIES

AVDD

Analog supply voltage

1.7

1.8

1.9

LVDD

Digital supply voltage

1.7

1.8

1.9

ANALOG INPUTS/OUTPUTS

Differential input voltage range

VPP

Input common-mode voltage

0.95 ± 0.05

REFT

External reference mode

1.45

REFB

External reference mode

0.45

Common-mode voltage output

0.95

VCM

External Reference mode Input

1.5

Maximum Input Frequency (1)

2 VPP amplitude

MHz

CLOCK INPUTS

ADC Clock input sample rate

MSPS

Sine wave, AC-coupled

0.2

1.5

Input Clock amplitude differential

LVPECL, AC-coupled

0.2

1.6

VPP

(V(CLKP) – V(CLKN)) peak-to-peak

LVDS, AC-coupled

0.2

0.7

VIL

<0.3

Input Clock CMOS single-ended (V(CLKP))

VIH

>1.5

Input clock duty cycle

35%

50%

65%

DIGITAL OUTPUTS

ACLKP and ACLKN outputs (LVDS), 1-wire interface

1x (sample rate)

MSPS

LCLKP and LCLKN outputs (LVDS), 1-wire interface

7x (sample rate)

MSPS

ACLKP and ACLKN outputs (LVDS), 2-wire interface

0.5x (sample rate)

MSPS

LCLKP and LCLKN outputs (LVDS), 2-wire interface

3.5x (sample rate)

MSPS

Maximum data rate, 2-wire interface

560

Mbps

Maximum data rate, 1-wire interface

700

Mbps

CLOAD Maximum external capacitance from each output pin to LGND

RLOAD Differential load resistance between the LVDS output pairs

100

Operating free-air temperature

–40

°C

(1)

See the Large and Small Signal Input Bandwidth section.

8.4 Thermal Information

ADS5294

THERMAL METRIC(1)

PFP (HTQFP)

UNIT

80 PINS

RθJA

Junction-to-ambient thermal resistance

30.8

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

6.3

°C/W

RθJB

Junction-to-board thermal resistance

8.3

°C/W

ψJT

Junction-to-top characterization parameter

0.2

°C/W

ψJB

Junction-to-board characterization parameter

8.2

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

0.3

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

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