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BSP76 датащи(PDF) 10 Page - Infineon Technologies AG |
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BSP76 датащи(HTML) 10 Page - Infineon Technologies AG |
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10 / 10 page ![]() Page 10 2004-03-05 BSP 76 Revision History : 2004-03-05 Previous version : 2003-04-22 For questions on technology, delivery and prices please contact the Infineon Technologies Offices in Germany or the Infineon Technologies Companies and Representatives worldwide: see our webpage at http://www.infineon.com HITFET®, SIPMOS® are registered trademarks of Infineon Technologies AG. Edition 2004-02-02 Published by Infineon Technologies AG, St.-Martin-Strasse 53, D-81541 München, Germany © Infineon Technologies AG 2001 All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as a guarantee of characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Page Subjects (major changes since last revision) 2, 4 Footnote 2 extended to Vin<0V, Etot and ∆TjT 2, 3 Footnote 5 implemented to Ptot and ID(nom) 2 ESD test condition changed from MIL STD 883D, methode 3015.7 and EOS/ESD assn. standard S5.1-1993 to Jedec Norm EIA/JESD22-A114-B, Section 4 2 Humidity category classification changed from DIN 40040 value E to J-STD-20-B value MSL1 2 Climatic category changed from DIN IEC 68-1 to DIN EN 60068-1 3 VIN(th) test conditions from ID=0.15mA to ID=0.3mA |
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