Freescale USB Development Board USB-KW40Z User’s Guide, Rev. 0, 10/2015

Freescale Semiconductor, Inc

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PCB manufacturing specifications

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Copper foil

— Top and bottom copper layers must be 1 oz. copper

— Interior layers must be 1 oz. copper

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Plating—All pad plating must be Hot Air Levelling (HAL)

5.4

Solder mask

The solder mask must meet the following requirements:

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Solder mask type: Liquid Film Electra EMP110 or equivalent

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Solder mask thickness: 10–30 µm

5.5

Silk screen

The silk screen must meet the following requirements:

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Silk screen color: White

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Silk screen must be applied after application of solder mask if solder mask is required

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The silk screen ink must not extend into any plated-thru-holes

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The silk screen must be clipped back to the line of resistance

5.6

Electrical PCB testing

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All PCBs must be 100 percent tested for opens and shorts

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Impedance measurement - An impedance measurement report is not mandatory

5.7

Packaging

Packaging for the PCBs must meet the following requirements:

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Finished PCBs must remain in panel

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Finished PCBs must be packed in plastic bags that do not contain silicones or sulphur materials.

These materials can degrade solderability

5.8

Hole specification/tool table

See the ncdrill-1-4.tap file included with the Gerber files and the FAB-28441.pdf file.

5.9

File description

Files included with the download include Design, Gerber, and PDF files. Gerber files are RS-274x format.

Not all files included with the Gerber files are for PCB manufacturing.

PDF files included are:

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FAB-28441.pdf—USB- Board fabrication drawing

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GRB-28441.zip—USB- Metal layers, solder mask, solder paste and silk screen